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Microelectronics Reliability, Volume 79
Volume 79, December 2017
- Daisuke Fukushi, Akito Sasaki, Hideaki Hirabayashi, Masaaki Kitano
:
Effect of oxygen vacancy in tungsten oxide on the photocatalytic activity for decomposition of organic materials in the gas phase. 1-4 - Kiyoshi Mizuuchi, Kanryu Inoue, Yasuyuki Agari:
Trend of the development of metal-based heat dissipative materials. 5-19 - Forrest Baber, Ibrahim Guven:
Solder joint fatigue life prediction using peridynamic approach. 20-31 - David T. Chu, Yi-Cheng Chu, Jie-An Lin, Yi-Ting Chen, Chun-Chieh Wang, Yen-Fang Song, Cheng-Cheng Chiang, Chih Chen, King-Ning Tu:
Growth competition between layer-type and porous-type Cu3Sn in microbumps. 32-37 - Cheng Chen, Fengze Hou, Fengman Liu, Qian She, Liqiang Cao, Lixi Wan:
Thermo-mechanical reliability analysis of a RF SiP module based on LTCC substrate. 38-47 - Xunfei Zhou
Cycle life estimation of lithium-ion polymer batteries using artificial neural network and support vector machine with time-resolved thermography. 48-58 - Meng Chuan Lee, Hin Yong Wong
Investigation on X-ray irradiation on nanoscale nitride based charge trapping flash memory devices. 59-68 - A. M. Najib, Mohd Zulkifly Abdullah, Abdullah Aziz Saad
Numerical simulation of self-alignment of chip resistor components for different silver content during reflow soldering. 69-78 - Haider Muhi Abbas
BTI mitigation by anti-ageing software patterns. 79-90 - Naoyuki Nishikawa, Seira Yamaguchi
Direct observation of changes in the effective minority-carrier lifetime of SiNx-passivated n-type crystalline-silicon substrates caused by potential-induced degradation and recovery tests. 91-95 - Pawel Górecki
Modelling the temperature influence on dc characteristics of the IGBT. 96-103 - Peter Meszmer
Stress imaging in structural challenging MEMS with high sensitivity using micro-Raman spectroscopy. 104-110 - Bruna Cardoso Paz, Renan Trevisoli Doria, Mikaël Cassé, Sylvain Barraud, Gilles Reimbold, Maud Vinet, Olivier Faynot, Marcelo Antonio Pavanello:
Harmonic distortion analysis of triple gate SOI nanowire MOSFETS down to 100 K. 111-118 - Tadahiro Shibutani, Jing Wen Sun:
Nucleation and shrinkage of defects on the surface of tin induced by local strain distribution. 119-123 - Jie Wu, Songbai Xue, Jingwen Wang, Jianxin Wang:
Comparative studies on microelectronic reliability issue of Sn whisker growth in Sn-0.3Ag-0.7Cu-1Pr solder under different environments. 124-135 - Yan-Lin Li, Kuei-Shu Chang-Liao, Yu-Wei Chang, Tse-Jung Huang, Chen-Chien Li, Zhao-Chen Gu, Po-Yen Chen, Tzung-Yu Wu, Jiayi Huang, Fu-Chuan Chu, Shih-Han Yi:
Improved reliability characteristics of Ge MOS devices by capping Hf or Zr on interfacial layer. 136-139 - Hadiza Ahmad Abubakar, Dino Isa, Wong Yee Wan:
Comparing the degradation effect of a 'two-cell' Supercapacitor-module with and without voltage equalization circuit(s) under experimental self-discharge and load cycling tests. 140-148 - Yao Ma, Pengfei Xu, Mingyue Guan, Filippo Boi, Gao Bo, Min Gong, Xue Wu, Yuxin Wang, Hua Wang, ZengQiang Niao:
Analysis of deep level defects in bipolar junction transistors irradiated by 2 MeV electrons. 149-152 - Morteza Khoshvaght-Aliabadi
Effects of nooks configuration on hydrothermal performance of zigzag channels for nanofluid-cooled microelectronic heat sink. 153-165 - Fan Liu, Lei Su, Mengying Fan, Jian Yin, Zhenzhi He, Xiangning Lu:
Using scanning acoustic microscopy and LM-BP algorithm for defect inspection of micro solder bumps. 166-174 - Ben Cornelius, Shay Treivish, Yair Rosenthal, Michael G. Pecht:
The phenomenon of tin pest: A review. 175-192 - Somayeh Fotoohi, Saeed Haji-Nasiri
Transfer matrix model of multilayer graphene nanoribbon interconnects. 193-200 - Aihua Dong, Javier A. Salcedo, Srivatsan Parthasarathy, Yuanzhong Paul Zhou, Sirui Luo, Jean-Jacques Hajjar, Juin J. Liou:
ESD protection structure with reduced capacitance and overshoot voltage for high speed interface applications. 201-205 - Ee-Hua Wong
Interface and interconnection stresses in electronic assemblies - A critical review of analytical solutions. 206-220 - Youhu Zhao, Enrico Zio, Guicui Fu:
Remaining storage life prediction for an electromagnetic relay by a particle filtering-based method. 221-230 - Bin Lu, Hongliang Lu, Yuming Zhang, Yimen Zhang, Xiaoran Cui, Chengji Jin, Chen Liu:
Improved analytical model of surface potential with modified boundary conditions for double gate tunnel FETs. 231-238 - Dheeraj Kumar Sinha
SPICE level implementation of physics of filamentation in ESD protection devices. 239-247 - Erping Deng
Study on the methods to measure the junction-to-case thermal resistance of IGBT modules and press pack IGBTs. 248-256 - Xue Kang, Yiping Wang, Qunwu Huang, Yong Cui, Chen Wang, Chen Wen, Jiangyang Fan:
Phase-change immersion cooling high power light emitting diodes and heat transfer improvement. 257-264 - M. Lisiansky, Y. Raskin, Y. Roizin, B. Meyler, S. Yofis, Y. Shneider:
Peculiarities of hole trapping in Al2O3-SiO2 gate dielectric stack. 265-269 - Hua-Chiang Wen, Wu-Ching Chou, Shiuan Huei Lin, Don Son Jiang:
Nanomechanical properties of Ag solder bumps doped with Pd and Au. 270-275 - A. A. Dakhel
Improving carrier mobility with vanadium doping of transparent conducting CdO. 276-280 - Giulio Torrente, Jean Coignus
Physically-based evaluation of aging contributions in HC/FN-programmed 40 nm NOR Flash technology. 281-287 - A. Ben Kabaar, Cyril Buttay
Characterization of materials and their interfaces in a direct bonded copper substrate for power electronics applications. 288-296 - Luka Kljucar, Mario Gonzalez, Kristof Croes, Ingrid De Wolf, Joke De Messemaeker, Gayle Murdoch, Philip Nolmans, Joeri De Vos, Jürgen Bömmels, Eric Beyne
Impact of via density and passivation thickness on the mechanical integrity of advanced Back-End-Of-Line interconnects. 297-305 - Ling-Ling Li, Yu-Han Ren, Ching-Hsin Wang, Ching-Tsung Jen:
A new method to estimate the state of charge of the green battery. 306-313 - Renuka Vallabhaneni, Ehsan Izadi, Carl R. Mayer, C. Shashank Kaira, Sudhanshu S. Singh
In situ tensile testing of tin (Sn) whiskers in a focused ion beam (FIB)/scanning electron microscope (SEM). 314-320 - Dong-Woon Han
Effect of normal forces on fretting corrosion of tin-coated electrical contacts. 321-327 - Dong Hyun Park, Sojin Shin, Yeong K. Kim:
Module packaging effects on MEMS airbag sensor performance for automobiles. 328-335 - M. S. Haslinda, Aizat Abas
Discrete phase method particle simulation of ultra-fine package assembly with SAC305-TiO2 nano-reinforced lead free solder at different weighted percentages. 336-351 - Hassen M. Ouakad
Reliability of MEMS shallow arches based actuator under the combined effect of mechanical shock and electric loads. 352-359
- Márta Rencz:
Thermal investigations of integrated circuits and systems, THERMINIC'16. 360 - Lorenzo Codecasa
Partition-based approach to parametric dynamic compact thermal modeling. 361-370 - Lorenzo Codecasa
3-D thermal models calibration by parametric dynamic compact thermal models. 371-379 - Samson Melamed
Thermal impact of extreme die thinning in bump-bonded three-dimensional integrated circuits. 380-386 - László Pohl, Soma Ur
Thermoelectrical modelling and simulation of devices based on VO2. 387-394 - Attahir Murtala Aliyu, Alberto Castellazzi
Measuring structure functions of power devices in inverters. 395-404 - Marcin Janicki
Experimental investigation of discrete air cooled device thermal resistance dependence on cooling conditions. 405-409 - Marco Ranieri, Diego Alberto, Hélène Piret, Viviane Cattin
Electronic module for the thermal monitoring of a Li-ion battery cell through the electrochemical impedance estimation. 410-415 - Konstantin O. Petrosyants, Igor A. Kharitonov, Sergey V. Lebedev, Lev M. Sambursky
Electrical characterization and reliability of submicron SOI CMOS technology in the extended temperature range (to 300 °C). 416-425 - G. Casano, S. Piva:
Experimental investigation of a Peltier cells cooling system for a Switch-Mode Power Supply. 426-432 - Charles-Alexis Lefebvre
Implementation of a fast relative digital temperature sensor to achieve thermal protection in Zynq SoC technology. 433-439 - Krzysztof Górecki
Modelling LED lamps in SPICE with thermal phenomena taken into account. 440-447 - Jozsef Hegedus, Gusztáv Hantos
Light output stabilisation of LED based streetlighting luminaires by adaptive current control. 448-456 - Anton E. Chernyakov
Experimental study of electroluminescence and temperature distribution in high-power AlGaInN LEDs & LED arrays. 457-461 - Lisa Mitterhuber
Validation methodology to analyze the temperature-dependent heat path of a 4-chip LED module using a finite volume simulation. 462-472 - Kaj Lampio
Optimization of convectively cooled heat sinks. 473-479 - Gábor Takács, György Bognár, Eniko Bándy, Gábor Rózsás, Péter G. Szabó
Fabrication and characterization of microscale heat sinks. 480-487 - Piotr Zajac
Peak temperature reduction by optimizing power density distribution in 3D ICs with microchannel cooling. 488-498 - Lázár Jani, András Poppe
Framework for thermal-aware verification of digital and mixed signal systems. 499-508 - Cosmin-Sorin Plesa
Design methodology for over-temperature and over-current protection of an LDO voltage regulator by using electro-thermal simulations. 509-516 - Avisek Roy, Ferenc Ender
CMOS micro-heater design for direct integration of carbon nanotubes. 517-525 - Zygimantas Staliulionis, Sankhya Mohanty
Mathematical modelling of moisture transport into an electronic enclosure under non-isothermal conditions. 526-532 - E. Liu, Thomas Zahner, Sebastian Besold, Bernhard Wunderle
Location resolved transient thermal analysis to investigate crack growth in solder joints. 533-546 - N. van Veen, W. Luiten:
Force and collapsed shape of a liquid solder bump under load. 547-553
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