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Tadahiro Shibutani
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2020 – today
- 2021
- [j13]Masahito Takezawa
, Yuto Otoguro
Fabrication of doubly-curved CFRP shell structures with control over fiber directions. Comput. Aided Des. 136: 103028 (2021)
2010 – 2019
- 2018
- [j12]Junji Sakamoto
Potential failure mode identification of operational amplifier circuit board by using high accelerated limit test. Microelectron. Reliab. 85: 19-24 (2018) - 2017
- [j11]Junji Sakamoto
Finite element analysis of thermal and mechanical stresses due to the grain anisotropy of polycrystalline β-Sn. Microelectron. Reliab. 71: 29-34 (2017) - [j10]Tadahiro Shibutani, Jing Wen Sun:
Nucleation and shrinkage of defects on the surface of tin induced by local strain distribution. Microelectron. Reliab. 79: 119-123 (2017) - 2016
- [j9]Daeil Kwon
IoT-Based Prognostics and Systems Health Management for Industrial Applications. IEEE Access 4: 3659-3670 (2016) - [j8]Takuma Imai, Tadahiro Shibutani, Kazumi Matsui, Seitoku Kumagai, Dang Tien Tran
Curvature sensitive analysis of axially compressed cylindrical tubes with corrugated surface using isogeometric analysis and experiment. Comput. Aided Geom. Des. 49: 17-30 (2016) - [j7]Michael G. Pecht, Tadahiro Shibutani, Lifeng Wu:
A reliability assessment guide for the transition planning to lead-free electronics for companies whose products are RoHS exempted or excluded. Microelectron. Reliab. 62: 113-123 (2016) - [j6]Michael G. Pecht, Tadahiro Shibutani, Myeongsu Kang, Melinda Hodkiewicz
A fusion prognostics-based qualification test methodology for microelectronic products. Microelectron. Reliab. 63: 320-324 (2016) - 2012
- [j5]Hiroki Yoshihara, Tatsuya Yoshii, Tadahiro Shibutani, Takashi Maekawa
Topologically robust B-spline surface reconstruction from point clouds using level set methods and iterative geometric fitting algorithms. Comput. Aided Geom. Des. 29(7): 422-434 (2012) - [j4]Hyun-Seok Oh
Precursor monitoring approach for reliability assessment of cooling fans. J. Intell. Manuf. 23(2): 173-178 (2012)
2000 – 2009
- 2008
- [j3]Qiang Yu, Tadahiro Shibutani, Do-Seop Kim, Yusuke Kobayashi, Jidong Yang, Masaki Shiratori:
Effect of process-induced voids on isothermal fatigue resistance of CSP lead-free solder joints. Microelectron. Reliab. 48(3): 431-437 (2008) - [j2]Tadahiro Shibutani, Qiang Yu, Masaki Shiratori, Michael G. Pecht
Pressure-induced tin whisker formation. Microelectron. Reliab. 48(7): 1033-1039 (2008) - [j1]Tadahiro Shibutani, Ji Wu, Qiang Yu, Michael G. Pecht
Key reliability concerns with lead-free connectors. Microelectron. Reliab. 48(10): 1613-1627 (2008) - [c1]Tadahiro Shibutani, Qiang Yu, Masaki Shiratori:
Effect of Creep Properties on Pressure Induced Tin Whisker Formation. SSIRI 2008: 197-198
Coauthor Index
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