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"Discrete phase method particle simulation of ultra-fine package assembly ..."

M. S. Haslinda et al. (2017)

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DOI: 10.1016/J.MICROREL.2017.07.054

access: closed

type: Journal Article

metadata version: 2022-11-25

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M. S. Haslinda, Aizat Abas, F. Che Ani, A. Jalar, Abdullah Aziz Saad, Mohd Zulkifly Abdullah:
Discrete phase method particle simulation of ultra-fine package assembly with SAC305-TiO₂ nano-reinforced lead free solder at different weighted percentages. Microelectron. Reliab. 79: 336-351 (2017)

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