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Bernhard Wunderle

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2020 – today

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2024
[j15]
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  - journals/remotesensing/KettelgerdesSEWE24
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  - https://dblp.org/rec/journals/remotesensing/KettelgerdesSEWE24
Marcel Kettelgerdes, Nicolas Sarmiento, Hüseyin Erdogan, Bernhard Wunderle, Gordon Elger:
Precise Adverse Weather Characterization by Deep-Learning-Based Noise Processing in Automotive LiDAR Sensors. Remote. Sens. 16(13): 2407 (2024)
2023
[c4]
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  - conf/m2vip/KettelgerdesPUEWE23
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Marcel Kettelgerdes, Amit Pandey, Denis Unruh, Hüseyin Erdogan, Bernhard Wunderle, Gordon Elger:
Automotive LiDAR Based Precipitation State Estimation Using Physics Informed Spatio-Temporal 3D Convolutional Neural Networks (PIST-CNN). M2VIP 2023: 1-6
[i1]
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  - journals/corr/abs-2312-04229
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Marcel Kettelgerdes, Tjorven Hillmann, Thomas Hirmer, Hüseyin Erdogan, Bernhard Wunderle, Gordon Elger:
Accelerated Real-Life (ARL) Testing and Characterization of Automotive LiDAR Sensors to facilitate the Development and Validation of Enhanced Sensor Models. CoRR abs/2312.04229 (2023)
2022
[j14]
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  - journals/sensors/BouhamedJNBHWK22
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Ayda Bouhamed, Nathanael Jöhrmann, Slim Naifar, Benny Böhm, Olav Hellwig, Bernhard Wunderle, Olfa Kanoun:
Collaborative Filler Network for Enhancing the Performance of BaTiO3/PDMS Flexible Piezoelectric Polymer Composite Nanogenerators. Sensors 22(11): 4181 (2022)

2010 – 2019

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2017
[j13]
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  - journals/mr/HeilmannNZMPW17
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Jens Heilmann, Ivan Nikitin, Uwe Zschenderlein, Daniel May, Klaus Pressel, Bernhard Wunderle:
Reliability experiments of sintered silver based interconnections by accelerated isothermal bending tests. Microelectron. Reliab. 74: 136-146 (2017)
[j12]
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  - journals/mr/MeszmerRSZW17
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Peter Meszmer, Raul D. Rodriguez, Evgeniya Sheremet, Dietrich R. T. Zahn, Bernhard Wunderle:
Stress imaging in structural challenging MEMS with high sensitivity using micro-Raman spectroscopy. Microelectron. Reliab. 79: 104-110 (2017)
[j11]
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  - journals/mr/LiuZBWE17
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E. Liu, Thomas Zahner, Sebastian Besold, Bernhard Wunderle, Gordon Elger:
Location resolved transient thermal analysis to investigate crack growth in solder joints. Microelectron. Reliab. 79: 533-546 (2017)
2016
[j10]
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  - journals/mr/PoshtanRSW16
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Emad A. Poshtan, Sven Rzepka, Christian Silber, Bernhard Wunderle:
An in-situ numerical-experimental approach for fatigue delamination characterization in microelectronic packages. Microelectron. Reliab. 62: 18-25 (2016)
[c3]
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  - conf/nems/BonitzBHSGHW16
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Jens Bonitz, Simon Böttger, Sascha Hermann, Stefan E. Schulz, Thomas Gessner, Steffen Hartmann, Bernhard Wunderle:
Wafer-level technology for integration of carbon nanotubes into micro-electro-mechanical systems. NEMS 2016: 595-599
2014
[j9]
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  - journals/mr/Schindler-SaefkowROPMWMRK14
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Florian Schindler-Saefkow, Florian Rost, Alexander Otto, R. Pantou, Raul Mroßko, Bernhard Wunderle, Bernd Michel, Sven Rzepka, Jürgen Keller:
Stress impact of moisture diffusion measured with the stress chip. Microelectron. Reliab. 54(6-7): 1243-1252 (2014)
2013
[j8]
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  - journals/mr/HolckBBWWWL13
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O. Hölck, Jörg Bauer, Tanja Braun, Hans Walter, Olaf Wittler, Bernhard Wunderle, Klaus-Dieter Lang:
Transport of moisture at epoxy-SiO₂ interfaces investigated by molecular modeling. Microelectron. Reliab. 53(8): 1111-1116 (2013)
2012
[j7]
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  - journals/mr/HolckBWMW12
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O. Hölck, Jörg Bauer, Olaf Wittler, Bernd Michel, Bernhard Wunderle:
Comparative characterization of chip to epoxy interfaces by molecular modeling and contact angle determination. Microelectron. Reliab. 52(7): 1285-1290 (2012)
[c2]
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  - conf/IEEEssd/WagnerHWSSG12
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Christian Wagner, Steffen Hartmann, Bernhard Wunderle, Jörg Schuster, Stefan E. Schulz, Thomas Gessner:
Nanomechanics of CNTs for sensor application. SSD 2012: 1-5
2011
[j6]
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  - journals/mr/HolckDW0M11
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O. Hölck, E. Dermitzaki, Bernhard Wunderle, Jörg Bauer, Bernd Michel:
Basic thermo-mechanical property estimation of a 3D-crosslinked epoxy/SiO₂ interface using molecular modelling. Microelectron. Reliab. 51(6): 1027-1034 (2011)
2010
[j5]
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  - journals/mr/WunderleDHBWSRFMR10
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Bernhard Wunderle, E. Dermitzaki, O. Hölck, Jörg Bauer, Hans Walter, Q. Shaik, K. Rätzke, Franz Faupel, Bernd Michel, Herbert Reichl:
Molecular dynamics approach to structure-property correlation in epoxy resins for thermo-mechanical lifetime modeling. Microelectron. Reliab. 50(7): 900-909 (2010)

2000 – 2009

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2009
[c1]
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  - conf/3dic/FritzschMBTKWWR09
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Thomas Fritzsch, Raul Mrossko, Tobias Baumgartner, Michael Toepper, Matthias Klein, Jürgen Wolf, Bernhard Wunderle, Herbert Reichl:
3-D thin chip integration technology - from technology development to application. 3DIC 2009: 1-8
2007
[j4]
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  - journals/mr/RoelligDWBWWM07
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Mike Roellig, Rainer Dudek, Steffen Wiese, Bjoern Boehme, Bernhard Wunderle, Klaus-Jürgen Wolter, Bernd Michel:
Fatigue analysis of miniaturized lead-free solder contacts based on a novel test concept. Microelectron. Reliab. 47(2-3): 187-195 (2007)
[j3]
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  - journals/mr/SpraulNMWM07
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M. Spraul, Wolfgang Nüchter, A. Möller, Bernhard Wunderle, Bernd Michel:
Reliability of SnPb and Pb-free flip-chips under different test conditions. Microelectron. Reliab. 47(2-3): 252-258 (2007)
2006
[j2]
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  - journals/mr/WunderleM06
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Bernhard Wunderle, Bernd Michel:
Progress in reliability research in the micro and nano region. Microelectron. Reliab. 46(9-11): 1685-1694 (2006)
2004
[j1]
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  - journals/mr/WunderleNSMR04
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Bernhard Wunderle, Wolfgang Nüchter, Andreas Schubert, Bernd Michel, Herbert Reichl:
Parametric FE-approach to flip-chip reliability under various loading conditions. Microelectron. Reliab. 44(12): 1933-1945 (2004)

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