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"Thermo-mechanical reliability analysis of a RF SiP module based on LTCC ..."

Cheng Chen et al. (2017)

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DOI: 10.1016/J.MICROREL.2017.10.003

access: closed

type: Journal Article

metadata version: 2020-02-22

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Cheng Chen, Fengze Hou, Fengman Liu, Qian She, Liqiang Cao, Lixi Wan:
Thermo-mechanical reliability analysis of a RF SiP module based on LTCC substrate. Microelectron. Reliab. 79: 38-47 (2017)

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