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Daniel M. Dreps
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2020 – today
- 2022
- [c17]Rahul M. Rao, Christopher J. Gonzalez, Eric Fluhr, Abraham Mathews, Andrew Bianchi, Daniel Dreps, David Wolpert, Eric Lai, Gerald Strevig, Glen A. Wiedemeier, Philipp Salz, Ryan Kruse:
POWER10™: A 16-Core SMT8 Server Processor With 2TB/s Off-Chip Bandwidth in 7nm Technology. ISSCC 2022: 48-50 - 2020
- [c16]Yang You, Glen A. Wiedemeier, Chad Marquart, Chris Steffen, Erik English, Dereje Yilma, Thomas Pham, Venkat Nammi, Jeffrey Okyere, Nathan Blanchard, Akil Sutton, Ze Zhang, David Friend, Diego Barba, Tyler Bohlke, Michael Spear, Vikram Raj, James Crugnale, Daniel Dreps, Pier Andrea Francese
, Marcel A. Kossel, Thomas Morf:
A 25×50Gb/s 2.22pJ/b NRZ RX with Dual-Bank and 3-Tap Speculative DFE for Microprocessor Application in 7nm FinFET CMOS. VLSI Circuits 2020: 1-2
2010 – 2019
- 2019
- [c15]James A. Kahle, Jaime Moreno, Daniel Dreps:
Summit and Sierra: Designing AI/HPC Supercomputers. ISSCC 2019: 42-43 - 2018
- [j10]Jeffrey Stuecheli, William J. Starke, John D. Irish, L. Baba Arimilli, Daniel M. Dreps, Bart Blaner, Curt Wollbrink, Brian Allison:
IBM POWER9 opens up a new era of acceleration enablement: OpenCAPI. IBM J. Res. Dev. 62(4/5): 8:1-8:8 (2018) - [j9]Sungjun Chun, Wiren Dale Becker
IBM POWER9 package technology and design. IBM J. Res. Dev. 62(4/5): 12:1-12:10 (2018) - [j8]Christopher J. Gonzalez
The 24-Core POWER9 Processor With Adaptive Clocking, 25-Gb/s Accelerator Links, and 16-Gb/s PCIe Gen4. IEEE J. Solid State Circuits 53(1): 91-101 (2018) - 2017
- [c14]Christopher J. Gonzalez, Eric Fluhr, Daniel Dreps, David Hogenmiller, Rahul M. Rao, Jose Paredes, Michael S. Floyd, Michael A. Sperling, Ryan Kruse, Vinod Ramadurai, Ryan Nett, Md. Saiful Islam, Juergen Pille, Donald W. Plass:
3.1 POWER9™: A processor family optimized for cognitive computing with 25Gb/s accelerator links and 16Gb/s PCIe Gen4. ISSCC 2017: 50-51 - [c13]Bharat Sukhwani, Thomas Roewer, Charles L. Haymes, Kyu-Hyoun Kim
Contutto: a novel FPGA-based prototyping platform enabling innovation in the memory subsystem of a server class processor. MICRO 2017: 15-26 - 2015
- [j7]Victor V. Zyuban, Joshua Friedrich, Daniel M. Dreps, Jürgen Pille, Donald W. Plass, Phillip J. Restle, Zeynep Toprak Deniz, Matthew M. Ziegler, Sam G. Chu, Md. Saiful Islam, James D. Warnock, Bob Philhower, Rahul M. Rao, Gregory S. Still, David Shan, Eric Fluhr, Jose Paredes, Dieter F. Wendel, Christopher J. Gonzalez, D. Hogenmiller, Ruchir Puri, Scott A. Taylor, Stephen D. Posluszny:
IBM POWER8 circuit design and energy optimization. IBM J. Res. Dev. 59(1) (2015) - [j6]Eric J. Fluhr, Steve Baumgartner, David W. Boerstler, John F. Bulzacchelli, Timothy Diemoz, Daniel Dreps, George English, Joshua Friedrich, Anne Gattiker, Tilman Gloekler, Christopher J. Gonzalez, Jason Hibbeler, Keith A. Jenkins, Yong Kim, Paul Muench, Ryan Nett, Jose Paredes, Juergen Pille, Donald W. Plass, Phillip J. Restle, Raphael Robertazzi, David Shan, David W. Siljenberg, Michael A. Sperling, Kevin Stawiasz, Gregory S. Still, Zeynep Toprak Deniz, James D. Warnock, Glen A. Wiedemeier, Victor V. Zyuban:
The 12-Core POWER8™ Processor With 7.6 Tb/s IO Bandwidth, Integrated Voltage Regulation, and Resonant Clocking. IEEE J. Solid State Circuits 50(1): 10-23 (2015) - [c12]James D. Warnock, Brian W. Curran, John Badar, Gregory Fredeman, Donald W. Plass, Yuen H. Chan, Sean M. Carey, Gerard Salem, Friedrich Schroeder, Frank Malgioglio, Guenter Mayer, Christopher J. Berry, Michael H. Wood, Yiu-Hing Chan, Mark D. Mayo, John Isakson, Charudhattan Nagarajan, Tobias Werner, Leon J. Sigal, Ricardo Nigaglioni, Mark Cichanowski, Jeffrey A. Zitz, Matthew M. Ziegler, Tim Bronson, Gerald Strevig, Daniel Dreps, Ruchir Puri, Douglas Malone, Dieter F. Wendel, Pak-kin Mak, Michael A. Blake:
4.1 22nm Next-generation IBM System z microprocessor. ISSCC 2015: 1-3 - [c11]Daniel Dreps:
How server designs will change as interface bandwidth demands continue to increase. OFC 2015: 1 - 2014
- [c10]Joshua Friedrich, Hung Q. Le, William J. Starke, Jeff Stuecheli, Balaram Sinharoy, Eric J. Fluhr, Daniel M. Dreps, Victor V. Zyuban, Gregory S. Still, Christopher J. Gonzalez, David Hogenmiller, Frank Malgioglio, Ryan Nett, Ruchir Puri, Phillip J. Restle, David Shan, Zeynep Toprak Deniz, Dieter F. Wendel, Matthew M. Ziegler, Dave W. Victor:
The POWER8TM processor: Designed for big data, analytics, and cloud environments. ICICDT 2014: 1-4 - [c9]Eric J. Fluhr, Joshua Friedrich, Daniel M. Dreps, Victor V. Zyuban, Gregory S. Still, Christopher J. Gonzalez, Allen Hall, David Hogenmiller, Frank Malgioglio, Ryan Nett, Jose Paredes, Juergen Pille, Donald W. Plass, Ruchir Puri, Phillip J. Restle, David Shan, Kevin Stawiasz, Zeynep Toprak Deniz, Dieter F. Wendel, Matthew M. Ziegler:
5.1 POWER8TM: A 12-core server-class processor in 22nm SOI with 7.6Tb/s off-chip bandwidth. ISSCC 2014: 96-97 - 2012
- [j5]Thomas Toifl, Christian Menolfi, Michael Ruegg, Robert Reutemann, Daniel Dreps, Troy J. Beukema, Andrea Prati, Daniele Gardellini, Marcel A. Kossel, Peter Buchmann, Matthias Braendli
A 2.6 mW/Gbps 12.5 Gbps RX With 8-Tap Switched-Capacitor DFE in 32 nm CMOS. IEEE J. Solid State Circuits 47(4): 897-910 (2012) - 2011
- [j4]Dieter F. Wendel, Ronald N. Kalla, James D. Warnock, Robert Cargnoni, Sam G. Chu, Joachim G. Clabes, Daniel Dreps, David Hrusecky, Joshua Friedrich, Md. Saiful Islam, James A. Kahle, Jens Leenstra, Gaurav Mittal, Jose Paredes, Juergen Pille, Phillip J. Restle, Balaram Sinharoy, George Smith, William J. Starke, Scott A. Taylor, James Van Norstrand, Stephen Weitzel, Phillip G. Williams, Victor V. Zyuban:
POWER7™, a Highly Parallel, Scalable Multi-Core High End Server Processor. IEEE J. Solid State Circuits 46(1): 145-161 (2011) - 2010
- [j3]Robert Reutemann, Michael Ruegg, Fran Keyser, John Bergkvist, Daniel Dreps, Thomas Toifl, Martin L. Schmatz:
A 4.5 mW/Gb/s 6.4 Gb/s 22+1-Lane Source Synchronous Receiver Core With Optional Cleanup PLL in 65 nm CMOS. IEEE J. Solid State Circuits 45(12): 2850-2860 (2010) - [c8]L. Baba Arimilli, Steve Baumgartner, Scott Clark, Daniel Dreps, David W. Siljenberg, Andrew Maki:
The IBM POWER7 HUB module: A terabyte interconnect switch for high-performance computer systems. Hot Chips Symposium 2010: 1-33 - [c7]Robert Reutemann, Michael Ruegg, Fran Keyser, John Bergkvist, Daniel Dreps, Thomas Toifl, Martin L. Schmatz:
A 4.5mW/Gb/s 6.4Gb/s 22+1-lane source-synchronous link rx core with optional cleanup PLL in 65nm CMOS. ISSCC 2010: 160-161 - [c6]Rohan Mandrekar, Yaping Zhou, Sungjun Chun, Anand Haridass, Jinwoo Choi, Nanju Na, Daniel M. Dreps, Roger D. Weekly, Paul Harvey:
Channel Optimization for the Design of High Speed I/O links. VLSI Design 2010: 87-92
2000 – 2009
- 2009
- [j2]Thomas-Michael Winkel, Hubert Harrer, Dierk Kaller, Jochen Supper, Daniel M. Dreps, Kenneth L. Christian, D. Cosmadelis, Tingdong Zhou, Thomas Strach, J. Ludwig, David L. Edwards:
Packaging design challenges of the IBM System z10 Enterprise Class server. IBM J. Res. Dev. 53(1): 10 (2009) - [c5]Yulei Zhang, Ling Zhang, Alina Deutsch, George A. Katopis, Daniel M. Dreps, James F. Buckwalter, Ernest S. Kuh, Chung-Kuan Cheng:
Design methodology of high performance on-chip global interconnect using terminated transmission-line. ISQED 2009: 451-458 - [c4]Kyu-Hyoun Kim
A 5.4mW 0.0035mm2 0.48psrms-jitter 0.8-to-5GHz non-PLL/DLL all-digital phase generator/rotator in 45nm SOI CMOS. ISSCC 2009: 98-99 - 2008
- [c3]Ling Zhang, Wenjian Yu, Haikun Zhu, Alina Deutsch, George A. Katopis, Daniel M. Dreps, Ernest S. Kuh, Chung-Kuan Cheng:
Low power passive equalizer optimization using tritonic step response. DAC 2008: 570-573 - [c2]Ling Zhang, Wenjian Yu, Yulei Zhang, Renshen Wang, Alina Deutsch, George A. Katopis, Daniel M. Dreps, James F. Buckwalter, Ernest S. Kuh, Chung-Kuan Cheng:
Low Power Passive Equalizer Design for Computer Memory Links. Hot Interconnects 2008: 51-56 - [c1]Kyu-Hyoun Kim
A 2.6mW 370MHz-to-2.5GHz Open-Loop Quadrature Clock Generator. ISSCC 2008: 458-459 - 2007
- [j1]Hubert Harrer, Daniel M. Dreps, Thomas-Michael Winkel, Wolfgang Scholz, Bao G. Truong, Andreas Huber, Tingdong Zhou, Kenneth L. Christian, Gary F. Goth:
High-speed interconnect and packaging design of the IBM System z9 processor cage. IBM J. Res. Dev. 51(1/2): 37-52 (2007)
Coauthor Index
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