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Winbond Electronics Corporation (Chinese: 華邦電子公司; pinyin: Huábāng Diànzǐ Gōngsī) is a Taiwan-based corporation founded in 1987. It produces semiconductors and several types of integrated circuits (ICs) including dynamic random-access memory, static random-access memory, serial flash, microcontrollers, and Super I/O chips.
 | |
| Company type | Corporation |
|---|---|
| Industry | Semiconductors |
| Founded | 1987 |
| Headquarters | Taichung, Taiwan |
Key people | Arthur Yu-Cheng Chiao (Chairman & CEO) Tung-Yi Chan (President) |
| Products |
|
| Website | www |
Winbond is the largest brand-name IC supplier in Taiwan and one of the biggest suppliers of semiconductors worldwide.[citation needed]
History
editWinbond was established in 1987 in Hsinchu Science Park in Taiwan.[1][2] Its founder came from the Industrial Technology Research Institute.[3] From 1987 to 1988 J.J Pan and Partners designed and constructed a fabrication plant known as IC Wafer Fab I Plant. This facility would produce 6 inch wafers. It was designed and constructed in 14 months. Later in 1989 to 1992, J.J Pan and Partners built a second fab for Winbond called IC Wafer Fab II Plant.[4]
In 1992 Winbond joined the Precision RISC Organization and licensed HP's PA-RISC architecture to design and manufacture chips for X terminals and printers.[5]
Winbond acquired affiliated chipset maker Symphony Laboratories, of San Jose, California, in October 1995.[6]
Winbond was affected by power cuts caused by the 1999 Jiji earthquake forcing the company to pause manufacturing.[7] By 2002 Winbond had 4,000 employees.[1] In 2004 Winbond was said to have a "continuous-learning culture", having 1,200 training programs for its employees.[8] In August 2004, Infineon announced a deal with Winbond to build a factory to make DRAM.[9]
The computer IC, consumer electronics IC, and logic product foundry divisions of Winbond were spun off as Nuvoton Technology Corporation on 1 July 2008.[citation needed]
In 2010 Winbond was manufacturing DDR2 DRAM using technology licensed from Qimonda.[10]
In 2019 Karamba Security partnered with Winbond to make secure embedded flash products.[11] In 2023 Winbond joined the Universal Chiplet Interconnect Express Consortium.[12]
See also
editReferences
edit- ^ a b Saperstein, Jeff; Rouach, Daniel (2002). Creating Regional Wealth in the Innovation Economy: Models, Perspectives, and Best Practices. FT Press. p. 225. ISBN 978-0-13-065415-1.
- ^ Jennex, Murray E. (2008). Knowledge Management: Concepts, Methodologies, Tools, and Applications. IGI Global. ISBN 978-1-59904-934-2.
- ^ Misa, Thomas J.; Brey, Philip; Feenberg, Andrew (2003). Modernity and Technology. MIT Press. p. 350. ISBN 978-0-262-63310-9.
- ^ Pan, Joshua Jih (1999). J.J. Pan and Partners: Selected and Current Works. Images Publishing. pp. 210–211. ISBN 978-1-86470-058-9.
- ^ Corcoran, Cate (1992-07-27). "Winbond gives HP another notch in its PA-RISC belt". InfoWorld. p. 30. Retrieved 2024-05-15.
- ^ LaPedus, Mark (October 30, 1995). "Winbond Plays It Out With Symphony". Electronic Buyers' News. CMP Publications: 3 – via ProQuest.
- ^ Tran, Mark (1999-09-21). "China offers aid after Taiwan quake". The Guardian. ISSN 0261-3077. Retrieved 2024-05-15.
- ^ Gupta, Jatinder N. D.; Sharma, Sushil Kumar (2004-01-01). Creating Knowledge Based Organizations. Idea Group Inc (IGI). p. 291. ISBN 978-1-59140-162-9.
- ^ Png, Ivan (2013-09-11). Managerial Economics, 4th Edition. Routledge. ISBN 978-1-136-29757-1.
- ^ "Winbond's innovative DRAM design and the legacy of Qimonda". EDN. 2010-08-12. Retrieved 2024-05-15.
- ^ Lynn, Alex (2019-12-02). "Winbond and Karamba Security partner for embedded cyber security". www.electronicspecifier.com. Retrieved 2024-05-15.
- ^ Fowle, Harry (2023-02-17). "Winbond joins UCIe Consortium to support chiplet interface standardisation". www.electronicspecifier.com. Retrieved 2024-05-15.
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