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List of semiconductor fabrication plants

This is a list of semiconductor fabrication plants. A semiconductor fabrication plant is where integrated circuits (ICs), also known as microchips, are manufactured. They are either operated by Integrated Device Manufacturers (IDMs) that design and manufacture ICs in-house and may also manufacture designs from design-only (fabless firms), or by pure play foundries that manufacture designs from fabless companies and do not design their own ICs. Some pure play foundries like TSMC offer IC design services, and others, like Samsung, design and manufacture ICs for customers, while also designing, manufacturing and selling their own ICs.

Glossary of terms

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  • Wafer size – largest wafer diameter that a facility is capable of processing. (Semiconductor wafers are circular.)
  • Process technology node – size of the smallest features that the facility is capable of etching onto the wafers.
  • Production capacity – a manufacturing facility's nameplate capacity. Generally max wafers produced per month.
  • Utilization – the number of wafers that a manufacturing plant processes in relation to its production capacity.
  • Technology/products – Type of product that the facility is capable of producing, as not all plants can produce all products on the market.

Open plants

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Operating fabs include:

Number of open fabs currently listed here: 488

(NOTE: Some fabs located in Asia don't use the number 4, or any 2 digit number that adds up to 4, because it is considered bad luck; see tetraphobia.)

Closed plants

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Company Plant Name Plant Location Plant Cost (in US$ Billions) Started Production Wafer Size (mm) Process Technology Node (nm) Production Capacity (Wafers/Month) Technology / Products Ended Production
VEF Soviet Union,
Latvia,
Riga 		1960 Semi-secret government semiconductor fab and a major research center separated from the Russian military manufacturing complex by the collapse of the USSR. 1999
Tower Semiconductor (formerly Micron) Fab 4[382] Japan,
Hyōgo,
Nishiwaki 		0.450[1] 1992[1] 200 95 60,000[1] DRAM, foundry 2014
Tower Semiconductor – Tacoma China,
Jiangsu,
Nanjing[383][384] 		halted, bankruptcy in June 2020[385] 200, 300 (planned) Foundry 2020
Fujian Jinhua (JHICC)[18][386][387][388] F2 China,
Fujian,
Jinjiang 		5.65[389] 2018 (planned) 300 22 60,000 DRAM[17] 2018
Decoma[18] F2 China,
Jiangsu,
Huai'an 		Under construction 300 20,000 2020
Wuhan Hongxin Semiconductor Manufacturing (HSMC)[390] China,
Hubei,
Wuhan 		2019 (halted) 300 14, 7 30,000[391] Foundry 2020
Tsinghua Unigroup – Unigroup Guoxin (Unigroup, Xi'an UniIC Semiconductors Co., Ltd.)[18] SZ China,
Guangdong,
Shenzhen 		12.5 Planned 300 50,000 DRAM 2019 (just plan)
TSMC Fab 1[230][139] Taiwan
Hsinchu,
Baoshan 		1987 150 2000-800 20,000 Foundry, CMOS, BiCMOS 2001, March 9
UMC Fab 1 Japan,
Chiba,
Tateyama 		0.543[1] 1997[1] 200 40,000 Foundry 2012
SK Hynix E-4 United States,
Oregon,
Eugene 		1.3 2007 200 30,000 DRAM 2008[392]
Symetrix – Panasonic[393] Brazil 0.9 (planned) planned FeRAM (just plan)
Rohm (formerly Data General) United States,
California,
Sunnyvale[394]
Kioxia Fab 1 (at Yokkaichi Operations)[395] Japan,
Mie,
Yokkaichi 		1992 200 400 35,000 SRAM, DRAM 2001, September
NEC Livingston[396][87] United Kingdom,
Scotland,
West Lothian,
Livingston 		4.5 (total) 1981 150, 200 800–350, 250, 180 30,000 CMOS, DRAM, SRAM, MCUs, ASICs, DSPs 2001, April
LFoundry [de] (formerly Renesas Electronics)[397] Germany,
Bavaria,
Landshut 		1992 200 2011
LFoundry [de] (formerly Atmel)[398] France,
Bouches-du-Rhône,
Rousset 		? 200 25.000[399]
Atmel (formerly Siemens) Fab 9[400] United Kingdom,
Tyne and Wear,
North Tyneside 		1.53[401] 1998[402] DRAM[402] 2007[403]
EI Niš Ei Poluprovodnici Serbia,
Nišava,
Niš 		1962 100 2000
Plessey Semiconductors (formerly Plus Semi) (formerly MHS Electronics) (formerly Zarlink) (formerly Mitel) (formerly Plessey Semiconductors) [189] UK,
Wiltshire,
Swindon[1] 		100, 150 800, 500 8,000 Bipolar, ASICs, linear ICs
Telefunken Semiconductors [de] Heilbronn, HNO-Line[189] Germany,
Baden-Württemberg,
Heilbronn 		0.125[1] 1993[1] 100, 150 800 10,000 Bipolar, CMOS, BiCMOS, GaAs, SiGe, ASICs, ASSPs, MCUs, discrete, optoelectronics 2015
Qimonda Richmond[404] United States,
Virginia,
Richmond 		3 2005 300 65 38,000 DRAM 2009, January
STMicroelectronics (formerly Nortel[204]) [189] United States,
California,
San Diego,
Rancho Bernardo 		100, 150 800, 500 NMOS, CMOS, BiCMOS 2002[405]
Freescale Semiconductor (formerly Motorola) Toulouse Fab[406] France,
Haute-Garonne,
Toulouse 		1969 150 650 Automotive 2012[407]
Freescale Semiconductor (formerly Motorola) (formerly Tohoku Semiconductor) Sendai Fab[408] Japan,
Miyagi,
Sendai 		1987 150, 200 500 DRAM, microcontrollers, analog, sensors 2009?
Agere Systems (formerly Lucent) (formerly AT&T)[409] Spain,
Madrid,
Tres Cantos 		0.67[410] 1987[411] 500, 350, 300 CMOS 2001
GMT Microelectronics (formerly Commodore Semiconductor) (formerly MOS Technology) United States,
Pennsylvania,
Audubon 		1969
1976
1995 		1000 1976
1992[412]
2001
Integrated Device Technology United States,
California,
Salinas 		1985 150 800-350[413] 2002
ON Semiconductor (formerly Cherry Semiconductor) [414] United States,
Rhode Island,
East Greenwich 		100, 150 1400 10,000 Bipolar, BiCMOS, Linear ICs and ASICs 2004
ON Semiconductor (formerly Motorola) [414] United States,
Arizona,
Phoenix 		150 5000-500 12,000 MOS, power discrete 2011
ON Semiconductor (formerly Motorola) Aizu Plant[414] Japan,
Aizu 		100, 150 1200, 1000 40,000 CMOS, MCUs, logic and smart power ICs 2012
ON Semiconductor (formerly Truesense Imaging, Kodak) Rochester United States,
New York,
Rochester[415] 		150 CCDs and Image Sensors 2020
Intel Fab 8[59] Israel,
Jerusalem District,
Jerusalem 		1985 150 Microprocessors, Chipsets, Microcontrollers[60] 2007
Intel Fab D2 United States,
California,
Santa Clara 		1989 200 130 8,000 Microprocessors, Chipsets, Flash memory 2009
Intel Fab 17[50][49] United States,
Massachusetts,
Hudson 		1998 200 130 Chipsets and other[49] 2014
Fairchild Semiconductor (formerly National Semiconductor) West Jordan United States,
Utah,
West Jordan 		1977 150 2015[416]
Texas Instruments HFAB United States,
Texas,
Houston 		1967 150 2013[417]
Texas Instruments (formerly Silicon Systems) Santa Cruz United States,
California,
Santa Cruz 		0.250 1980 150 800 80,000 HDD 2001
Texas Instruments (formerly National Semiconductor) Arlington United States,
Texas,
Arlington 		1985 150 80000, 35000 2010
Unknown (fortune 500 company) United States,
East Coast[418] 		150 1,600 MEMS 2016
Diodes Incorporated (formerly Lite-On Power Semiconductor) (formerly AT&T) KFAB United States,
Missouri,
Lee's Summit 		1994[419] 130 2017[420]
Qorvo (formerly TriQuint Semiconductor) (formerly Sawtek) United States,
Florida,
Apopka[74][421] 		SAW filters 2019
GlobalFoundries Abu Dhabi[1] UAE,
Emirate of Abu Dhabi,
Abu Dhabi[1] 		6.8[1] (planned) 2016[1] (planned) 300 180-110 45,000 Foundry 2011 (plan stopped)
GlobalFoundries – Chengdu China,
Sichuan,
Chengdu[422] 		10 (planned) 2018 (planned), 2019 (second phase) 300 180/130 (cancelled), 22 (second phase) 20,000 (85,000 planned) Foundry, FDSOI (second phase) 2020 (was idle)
Tondi Elektroonika[423] A-1381 Soviet Union,
Estonia,
Harju,
Tallinn 		1958 Radio equipment, Transisors, Photodiode 1978
Intersil (formerly Harris Semiconductor, formerly GE, formerly RCA) [414] United States,
Ohio,
Findlay 		1954 100, 125 2000, 1500, 1200 60,000 CMOS, bipolar, BiCMOS, Semiconductors, Optoelectronics, Integrated Circuits, Research[424] 2003[425]

Number of closed fabs currently listed here: 45

See also

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References

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Samsung capacity

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