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"Special Issue on 3D Sensing in Intelligent Transportation."

Chenglu Wen et al. (2021)

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DOI: 10.1109/TITS.2021.3067396

access: closed

type: Journal Article

metadata version: 2023-03-21

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Chenglu Wen, Ayman F. Habib, Jonathan Li, Charles K. Toth, Cheng Wang, Hongchao Fan:
Special Issue on 3D Sensing in Intelligent Transportation. IEEE Trans. Intell. Transp. Syst. 22(4): 1947-1949 (2021)

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