default search action

combined dblp search
author search
venue search
publication search

ask others

"TSV repairing for 3D ICs using redundant TSV."

Sudeep Ghosh et al. (2017)

> Home

Details and statistics

DOI: 10.1109/ISED.2017.8303914

access: closed

type: Conference or Workshop Paper

metadata version: 2022-10-02

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - conf/ised/GhoshRRG17
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/conf/ised/GhoshRRG17
Sudeep Ghosh, Surajit Kumar Roy, Hafizur Rahaman, Chandan Giri:
TSV repairing for 3D ICs using redundant TSV. ISED 2017: 1-5

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.