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"A thermal estimation model for 3D IC using liquid cooled microchannels and ..."

Surajit Kumar Roy et al. (2015)

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DOI: 10.1109/VLSI-SOC.2015.7314403

access: closed

type: Conference or Workshop Paper

metadata version: 2020-09-05

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  - conf/vlsi/RoyMGR15
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Surajit Kumar Roy, Supriyo Mandal, Chandan Giri, Hafizur Rahaman:
A thermal estimation model for 3D IC using liquid cooled microchannels and thermal TSVs. VLSI-SoC 2015: 122-127

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