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Herman Oprins
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2020 – today
- 2024
- [j9]Leandro Mateus Giacomini Rocha
, Refik Bilgic
Multidie 3-D Stacking of Memory Dominated Neuromorphic Architectures. IEEE Trans. Very Large Scale Integr. Syst. 32(11): 2144-2148 (2024) - [c13]Subrat Mishra, Bjorn Vermeersch, Sankatali Venkateswarlu, Halil Kukner, A. Sharma, G. Mirabeli, Fabian M. Bufler, Moritz Brunion, Dawit Burusie Abdi, Herman Oprins, Dwaipayan Biswas, Odysseas Zografos, Francky Catthoor, Pieter Weckx, Geert Hellings, James Myers, Julien Ryckaert:
Thermal Performance Evaluation of Multi-Core SOCs Using Power-Thermal Co-Simulation. IRPS 2024: 1-6 - [c12]Mohamed Naeim, Herman Oprins, Sudipta Das, Geert Van der Plas, Yun Dai, Pinhong Chen, CT Kao, Dwaipayan Biswas, Dragomir Milojevic:
Thermal Analysis of 3D Stacking and BEOL Technologies with Functional Partitioning of Many-Core RISC-V SoC. ISVLSI 2024: 33-38 - [c11]S. Mishra, Bjorn Vermeersch, Sankatali Venkateswarlu, Halil Kukner, Gioele Mirabelli, Fabian M. Bufler, Moritz Brunion, Dawit Burusie Abdi, Herman Oprins, Dwaipayan Biswas, Odysseas Zografos, Francky Catthoor, Pieter Weckx, Geert Hellings, James Myers, Julien Ryckaert:
Thermal Considerations for Block-Level PPA Assessment in Angstrom Era: A Comparison Study of Nanosheet FETs (A10) & Complementary FETs (A5). VLSI Technology and Circuits 2024: 1-2 - 2023
- [j8]David Coenen
Benchmarking of Machine Learning Methods for Multiscale Thermal Simulation of Integrated Circuits. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 42(7): 2264-2275 (2023) - [j7]Sankatali Venkateswarlu
Impact of 3-D Integration on Thermal Performance of RISC-V MemPool Multicore SOC. IEEE Trans. Very Large Scale Integr. Syst. 31(12): 1896-1904 (2023) - [c10]Melina Lofrano, Herman Oprins, Xinyue Chang, Bjorn Vermeersch, Olalla Varela Pedreira, Alicja Lesniewska, Vladimir Cherman, Ivan Ciofi, Kristof Croes, Seongho Park, Zsolt Tokei
Towards accurate temperature prediction in BEOL for reliability assessment (Invited). IRPS 2023: 1-7 - [c9]Subrat Mishra, Sankatali Venkateswarlu
Towards Chip-Package-System Co-optimization of Thermally-limited System-On-Chips (SOCs). IRPS 2023: 1-7 - [c8]David Coenen, Minkyu Kim, Herman Oprins, Ingrid De Wolf, Yoojin Ban, Joris Van Campenhout:
Coupled Dynamic Thermo-Optical Analysis and Compact Modelling of Self-Heating in Ring Modulator. PSC 2023: 1-3 - 2022
- [j6]Sankatali Venkateswarlu
Thermal Performance Analysis of Mempool RISC-V Multicore SoC. IEEE Trans. Very Large Scale Integr. Syst. 30(11): 1668-1676 (2022)
2010 – 2019
- 2019
- [c7]Kris Croes, Veerle Simons, Sofie Beyne, Vladimir Cherman, Herman Oprins, Michele Stucchi, Philippe Absil, A. Glabman, Eric Wilcox:
Understanding EM-Degradation Mechanisms in Metal Heaters Used for Si Photonics Applications. IRPS 2019: 1-4 - 2016
- [c6]Vice Sodan, Federica Lidia Teresa Maggioni, Herman Oprins, Steve Stoffels
New fast distributed thermal model for analysis of GaN based power devices. ESSDERC 2016: 172-175 - 2015
- [c5]Herman Oprins, Vladimir Cherman, Geert Van der Plas, F. L. T. Maggioni, Joeri De Vos, Eric Beyne
Thermal experimental and modeling analysis of high power 3D packages. ICICDT 2015: 1-4 - 2014
- [j5]F. L. T. Maggioni, Herman Oprins, Eric Beyne
Fast convolution based thermal model for 3D-ICs: Methodology, accuracy analysis and package impact. Microelectron. J. 45(12): 1746-1752 (2014) - 2012
- [j4]Herman Oprins, Bart Vandevelde, Martine Baelmans
Modeling and Control of Electrowetting Induced Droplet Motion. Micromachines 3(1): 150-167 (2012) - 2011
- [j3]Geert Van der Plas
Design Issues and Considerations for Low-Cost 3-D TSV IC Technology. IEEE J. Solid State Circuits 46(1): 293-307 (2011) - [j2]Herman Oprins, Adi Srinivasan
Fine grain thermal modeling and experimental validation of 3D-ICs. Microelectron. J. 42(4): 572-578 (2011) - [c4]Dragomir Milojevic
DRAM-on-logic Stack - Calibrated thermal and mechanical models integrated into PathFinding flow. CICC 2011: 1-4 - 2010
- [c3]Geert Van der Plas, Steven Thijs, Dimitri Linten, Guruprasad Katti, Paresh Limaye
Verifying electrical/thermal/thermo-mechanical behavior of a 3D stack - Challenges and solutions. CICC 2010: 1-4 - [c2]Nikolaos Minas, Ingrid De Wolf, Erik Jan Marinissen, Michele Stucchi, Herman Oprins, Abdelkarim Mercha, Geert Van der Plas, Dimitrios Velenis, Pol Marchal:
3D integration: Circuit design, test, and reliability challenges. IOLTS 2010: 217 - [c1]Geert Van der Plas
Design issues and considerations for low-cost 3D TSV IC technology. ISSCC 2010: 148-149
2000 – 2009
- 2008
- [j1]Herman Oprins, J. Danneels, B. Van Ham, Bart Vandevelde, Martine Baelmans
Convection heat transfer in electrostatic actuated liquid droplets for electronics cooling. Microelectron. J. 39(7): 966-974 (2008)
Coauthor Index
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