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"Design issues and considerations for low-cost 3D TSV IC technology."

Geert Van der Plas et al. (2010)

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DOI: 10.1109/ISSCC.2010.5434016

access: closed

type: Conference or Workshop Paper

metadata version: 2024-10-06

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  - conf/isscc/PlasLMOTTLSKVSCVSWLPBMCROPBORWDNADTMB10
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  - https://dblp.org/rec/conf/isscc/PlasLMOTTLSKVSCVSWLPBMCROPBORWDNADTMB10
Geert Van der Plas, Paresh Limaye, Abdelkarim Mercha, Herman Oprins, Cristina Torregiani, Steven Thijs, Dimitri Linten, Michele Stucchi, Guruprasad Katti, Dimitrios Velenis, Domae Shinichi, Vladimir Cherman, Bart Vandevelde, Veerle Simons, Ingrid De Wolf, Riet Labie, Dan Perry, Stephane Bronckers, Nikolaos Minas, Miro Cupac, Wouter Ruythooren, Jan Van Olmen, Alain Phommahaxay, Muriel de Potter de ten Broeck, Ann Opdebeeck, Michal Rakowski, Bart De Wachter, Morin Dehan, Marc Nelis, Rahul Agarwal, Wim Dehaene, Youssef Travaly, Pol Marchal, Eric Beyne:
Design issues and considerations for low-cost 3D TSV IC technology. ISSCC 2010: 148-149

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