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Takafumi Fukushima
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2020 – today
- 2023
- [c66]Mariappan Murugesan, M. Sawa, E. Sone, Makoto Motoyoshi, Mitsumasa Koyanagi, Takafumi Fukushima
:
Copper Electrode Surface Features and Cu-SiO2Hybrid Bonding. 3DIC 2023: 1-4 - [c65]Jiayi Shen, Chang Liu, Tadaaki Hoshi, Atsushi Sinoda, Hisashi Kino, Tetsu Tanaka, Mariappan Murugesan, Mitsumasa Koyanagi, Takafumi Fukushima
:
Impact of Super-long-throw PVD on TSV Metallization and Die-to-Wafer 3D Integration Based on Via-last. 3DIC 2023: 1-4 - [c64]Kohei Nakamura, Bang Du, Keishun Sugishita, Ryo Hasegawa, Hisashi Kino, Takafumi Fukushima
, Koji Kiyoyama, Tetsu Tanaka:
Development of Trans-nail PPG Controller Using Fingertip Blood Volume Changes to Enable Highly Accurate Motion Prediction. BioCAS 2023: 1-4 - 2022
- [j5]Yaogan Liang, Bang Du, Kohei Nakamura, Shengwei Wang, Bunta Inoue, Yuta Aruga, Hisashi Kino, Takafumi Fukushima
, Koji Kiyoyama, Tetsu Tanaka:
3D-stacked retinal prosthesis chip with binary image capture and edge detection functions for human visual restoration. IEICE Electron. Express 19(23): 20220363 (2022) - [c63]Kohei Nakamura, Yaogan Liang, Bang Du, Shengwei Wang, Yuta Aruga, Bunta Inoue, Hisashi Kino, Takafumi Fukushima
, Koji Kiyoyama, Tetsu Tanaka:
Implementation of Light and Dark Adaptation Function for High QOL 3D-Stacked Artificial Retina Chip. BioCAS 2022: 519-523 - 2021
- [c62]Takafumi Fukushima
, Shinichi Sakuyama, Masatomo Takahashi, Hiroyuki Hashimoto, Jichoel Bea, Theodorus Marcello, Hisashi Kino, Tetsu Tanaka, Mitsumasa Koyanagi, Mariappan Murugesan:
Integration of Damage-less Probe Cards Using Nano-TSV Technology for Microbumped Wafer Testing. 3DIC 2021: 1-4 - [c61]Koji Kiyoyama, Yoshihiko Horio
, Takafumi Fukushima
, Hiroyuki Hashimoto, Takemori Orima
, Mitsumasa Koyanagi
:
Design for 3-D Stacked Neural Network Circuit with Cyclic Analog Computing. 3DIC 2021: 1-4 - [c60]Mariappan Murugesan, E. Sone, A. Simomura, Makoto Motoyoshi, M. Sawa, K. Fukuda, Mitsumasa Koyanagi, Takafumi Fukushima
:
Cu-Cu Direct Bonding Through Highly Oriented Cu Grains for 3D-LSI Applications. 3DIC 2021: 1-4 - [c59]Yaogan Liana, Zhengyang Qian, Bang Du, Jinming Ye, Kohei Nakamura, Shengwei Wang, Hisashi Kino, Takafumi Fukushima
, Koji Kiyoyama, Tetsu Tanaka:
Design and Evaluation of Electronic-Microsaccade with Balanced Stimulation for Artificial Vision System. BioCAS 2021: 1-4 - [c58]Takafumi Fukushima
:
Chiplet-Based Advanced Packaging Technology from 3D/TSV to FOWLP/FHE. VLSI Circuits 2021: 1-2
2010 – 2019
- 2019
- [c57]Hisashi Kino
, Takafumi Fukushima
, Tetsu Tanaka:
Investigation of the Underfill with Negative-Thermal-Expansion Material to Suppress Mechanical Stress in 3D Integration System. 3DIC 2019: 1-4 - [c56]Koji Kiyoyama, Qian Zhengy, Hiroyuki Hashimoto, Hisashi Kino
, Takafumi Fukushima
, Tetsu Tanaka:
Development of a CDS Circuit for 3-D Stacked Neural Network Chip using CMOS Analog Signal Processing. 3DIC 2019: 1-4 - [c55]Shunji Kurooka, Yoshinori Hotta, Ai Nakamura, Mitsumasa Koyanagi, Takafumi Fukushima
:
Cu-Cu Bonding Challenges with 'i-ACF' for Advanced 3D Integration. 3DIC 2019: 1-4 - [c54]Sungho Lee, Yuki Susumago, Zhengyang Qian, Noriyuki Takahashi, Hisashi Kino
, Tetsu Tanaka, Takafumi Fukushima
:
Development of 3D-IC Embedded Flexible Hybrid System. 3DIC 2019: 1-4 - [c53]Rui Liang, Sungho Lee, Yuki Miwa, Kousei Kumahara, Mariappan Murugesan, Hisashi Kino
, Takafumi Fukushima
, Tetsu Tanaka:
Impacts of Deposition Temperature and Annealing Condition on Ozone-Ethylene Radical Generation-TEOS-CVD SiO2 for Low-Temperature TSV Liner Formation. 3DIC 2019: 1-4 - [c52]Yuki Miwa, Sungho Lee, Rui Liang, Kousei Kumahara, Hisashi Kino
, Takafumi Fukushima
, Tetsu Tanaka:
Characterization of Low-Height Solder Microbump Bonding for Fine-Pitch Inter-Chip Connection in 3DICs. 3DIC 2019: 1-4 - [c51]Mariappan Murugesan, Mitsumasa Koyanagi, Takafumi Fukushima
:
Growth Optimization of Multi-Layer Graphene for Thermal-TSV Application in 3D-LSI. 3DIC 2019: 1-5 - [c50]Mariappan Murugesan, Mitsumasa Koyanagi, Hiroyuki Hashimoto, Ji Chel Bea, Takafumi Fukushima
:
Fabrication and Morphological Characterization of Nano-Scale Interconnects for 3D-Integration. 3DIC 2019: 1-4 - [c49]Ryosuke Yabuki, Tetsu Tanaka
, Zhengyang Qian, Kar Mun Lee, Bang Du, Filipe Alves Satake, Tasuku Fukushima, Hisashi Kino
, Takafumi Fukushima
, Koji Kiyoyama:
PPG and SpO2 Recording Circuit with Ambient Light Cancellation for Trans-Nail Pulse-Wave Monitoring System. BioCAS 2019: 1-4 - 2018
- [c48]Kar Mun Lee, Zhengyang Qian, Ryosuke Yabuki, Bang Du, Hisashi Kino
, Takafumi Fukushima
, Koji Kiyoyama, Tetsu Tanaka
:
Continuous Peripheral Blood Pressure Measurement with ECG and PPG Signals at Fingertips. BioCAS 2018: 1-4 - [c47]Mariappan Murugesan, Takafumi Fukushima
, Ji Chel Bea, Hiroyuki Hashimoto, Mitsu Koyanagi:
Intra- and inter-chip electrical interconnection formed by directed self assembly of nanocomposite containing diblock copolymer and nanometal. IRPS 2018: 4 - 2017
- [c46]Kenji Shimokawa, Zhengyang Qian, Yoshiki Takezawa, Hisashi Kino
, Takafumi Fukushima
, Kouji Kiyoyama, Tetsu Tanaka
:
Experimental evaluation of stimulus current generator with Laplacian edge-enhancement for 3-D stacked retinal prosthesis chip. BioCAS 2017: 1-4 - [c45]Yoshiki Takezawa, Koji Kiyoyama, Kenji Shimokawa, Zhengyang Qian, Hisashi Kino
, Takafumi Fukushima
, Tetsu Tanaka
:
Ultrawide range square wave impedance analysis circuit with ultra-slow ring-oscillator using gate-induced drain-leakage current. BioCAS 2017: 1-4 - 2016
- [j4]Yasutaka Kamei, Takafumi Fukushima, Shane McIntosh, Kazuhiro Yamashita, Naoyasu Ubayashi
, Ahmed E. Hassan:
Studying just-in-time defect prediction using cross-project models. Empir. Softw. Eng. 21(5): 2072-2106 (2016) - [j3]Takafumi Fukushima
, Hideto Hashiguchi, Hiroshi Yonekura, Hisashi Kino
, Mariappan Murugesan
, Ji Chel Bea, Kang Wook Lee, Tetsu Tanaka
, Mitsumasa Koyanagi:
Oxide-Oxide Thermocompression Direct Bonding Technologies with Capillary Self-Assembly for Multichip-to-Wafer Heterogeneous 3D System Integration. Micromachines 7(10): 184 (2016) - [c44]Takafumi Fukushima
, Mariappan Murugesan, Shin Ohsaki, Hiroyuki Hashimoto, Jichoel Bea, Kang Wook Lee, Tetsu Tanaka
, Mitsumasa Koyanagi:
New concept of TSV formation methodology using Directed Self-Assembly (DSA). 3DIC 2016: 1-4 - [c43]Hisashi Kino
, Takafumi Fukushima
, Tetsu Tanaka
:
Drastic reduction of keep-out-zone in 3D-IC by local stress suppression with negative-CTE filler. 3DIC 2016: 1-4 - [c42]Kang Wook Lee, Ai Nakamura, Jicheol Bea, Takafumi Fukushima
, Suresh Ramalingam, Xin Wu, Tanaka Tanaka, Mitsumasa Koyanagi:
Nano-scale Cu direct bonding using ultra-high density Cu nano-pillar (CNP) for high yield exascale 2.5/3D integration applications. 3DIC 2016: 1-5 - [c41]Mariappan Murugesan, Jichel Bea, Takafumi Fukushima
, Makoto Motoyoshi, Tetsu Tanaka
, Mitsumasa Koyanagi:
Improving the integrity of Ti barrier layer in Cu-TSVs through self-formed TiSix for via-last TSV technology. 3DIC 2016: 1-4 - 2015
- [c40]K. W. Lee, Ji Chel Bea, Mitsu Koyanagi, Takafumi Fukushima
, Tetsu Tanaka
:
Advanced 2.5D/3D hetero-integration technologies at GINTI, Tohoku University. 3DIC 2015: FS2.1-FS2.5 - [c39]K. W. Lee, Chisato Nagai, Ai Nakamura, Hiroki Aizawa, Ji Chel Bea, Mitsumasa Koyanagi, Hideto Hashiguchi, Takafumi Fukushima
, Tanaka Tanaka:
Reconfigured multichip-on-wafer (mCoW) Cu/oxide hybrid bonding technology for ultra-high density 3D integration using recessed oxide, thin glue adhesive, and thin metal capping layers. 3DIC 2015: TS1.2.1-TS1.2.4 - [c38]Seiya Tanikawa, Hisashi Kino
, Takafumi Fukushima
, Mitsumasa Koyanagi, Tetsu Tanaka
:
Novel local stress evaluation method in 3D IC using DRAM cell array with planar mOS capacitors. 3DIC 2015: TS3.1.1-TS3.1.4 - [c37]Yangyang Yan, Yingtao Ding, Qianwen Chen, Kang Wook Lee, Takafumi Fukushima
, Mitsumasa Koyanagi:
Vacuum-assisted-spin-coating of polyimide liner for high-aspect-ratio TSVs applications. 3DIC 2015: TS5.2.1-TS5.2.5 - [c36]Takafumi Fukushima
, Taku Suzuki, Hideto Hashiguchi, Chisato Nagai, Jichoel Bea, Hiroyuki Hashimoto, Mariappan Murugesan, Kang Wook Lee, Tetsu Tanaka
, Kazushi Asami, Yasuhiro Kitamura, Mitsumasa Koyanagi:
Transfer and non-transfer stacking technologies based on chip-to-wafer self-asembly for high-throughput and high-precision alignment and microbump bonding. 3DIC 2015: TS7.4.1-TS7.4.4 - [c35]Mariappan Murugesan, Jichoel Bea, Hiroyuki Hashimoto, K. W. Lee, Mitsu Koyanagi, Takafumi Fukushima
, Tetsu Tanaka
:
Mitigating thermo mechanical stress in high-density 3D-LSI through dielectric liners in Cu- through silicon Via _ µ-RS and µ-XRD study. 3DIC 2015: TS8.10.1-TS8.10.5 - [c34]Hisashi Kino
, Hideto Hashiguchi, Seiya Tanikawa, Yohei Sugawara, Shunsuke Ikegaya
, Takafumi Fukushima
, Mitsumasa Koyanagi, Tetsu Tanaka
:
Consideration of microbump layout for reduction of local bending stress due to CTE Mismatch in 3D IC. 3DIC 2015: TS8.26.1-TS8.26.4 - [c33]Kang Wook Lee, Ji Chel Bea, Mariappan Murugesan, Takafumi Fukushima
, Tetsu Tanaka
, Mitsumasa Koyanagi:
Impacts of 3-D integration processes on device reliabilities in thinned DRAM chip for 3-D DRAM. IRPS 2015: 4 - 2014
- [c32]Takafumi Fukushima
, Yuka Ito, Mariappan Murugesan, Jicheol Bea, Kang Wook Lee, Koji Choki, Tetsu Tanaka
, Mitsumasa Koyanagi:
Tiny VCSEL chip self-assembly for advanced chip-to-wafer 3D and hetero integration. 3DIC 2014: 1-4 - [c31]K. W. Lee, Chisato Nagai, Ai Nakamura, Ji Chel Bea, Mariappan Murugesan, Takafumi Fukushima
, Tanaka Tanaka, Mitsumasa Koyanagi:
Effects of electro-less Ni layer as barrier/seed layers for high reliable and low cost Cu TSV. 3DIC 2014: 1-4 - [c30]Mariappan Murugesan, Takafumi Fukushima
, Ji Chel Bea, K. W. Lee, Mitsu Koyanagi, Y. Imai, S. Kimura, Tetsu Tanaka
:
Micro-XRD investigation of fine-pitch Cu-TSV induced thermo-mechanical stress in high-density 3D-LSI. 3DIC 2014: 1-4 - [c29]Takafumi Fukushima, Yasutaka Kamei, Shane McIntosh, Kazuhiro Yamashita, Naoyasu Ubayashi:
An empirical study of just-in-time defect prediction using cross-project models. MSR 2014: 172-181 - 2013
- [c28]Takafumi Fukushima
, Jichoel Bea, Mariappan Murugesan, Kang Wook Lee, Mitsumasa Koyanagi:
Development of via-last 3D integration technologies using a new temporary adhesive system. 3DIC 2013: 1-4 - [c27]Takafumi Fukushima
, Jichoel Bea, Mariappan Murugesan, Ho-Young Son
, M.-S. Suh, K.-Y. Byun, N.-S. Kim, Kang Wook Lee, Mitsumasa Koyanagi:
3D memory chip stacking by multi-layer self-assembly technology. 3DIC 2013: 1-4 - [c26]Hiroyuki Hashimoto, Takafumi Fukushima
, Kang Wook Lee, Mitsumasa Koyanagi, Tetsu Tanaka
:
Highly efficient TSV repair technology for resilient 3-D stacked multicore processor system. 3DIC 2013: 1-5 - [c25]Kouji Kiyoyama, Y. Sato, Hiroyuki Hashimoto, Kang Wook Lee, Takafumi Fukushima
, Tetsu Tanaka
, Mitsumasa Koyanagi:
A block-parallel ADC with digital noise cancelling for 3-D stacked CMOS image sensor. 3DIC 2013: 1-4 - [c24]Kang Wook Lee, Seiya Tanikawa, Mariappan Murugesan, H. Naganuma, Jichoel Bea, Takafumi Fukushima
, Tetsu Tanaka
, Mitsumasa Koyanagi:
Impact of 3-D integration process on memory retention characteristics in thinned DRAM chip for 3-D memory. 3DIC 2013: 1-4 - [c23]Mariappan Murugesan, Jichoel Bea, Kang Wook Lee, Takafumi Fukushima
, Tetsu Tanaka
, Mitsumasa Koyanagi, Yuji Sutou
, H. Wang, J. Koike:
Effect of CVD Mn oxide layer as Cu diffusion barrier for TSV. 3DIC 2013: 1-4 - 2011
- [j2]Takafumi Fukushima
, Takayuki Konno, Eiji Iwata, Risato Kobayashi, Toshiya Kojima, Mariappan Murugesan
, Ji Chel Bea, Kang Wook Lee, Tetsu Tanaka
, Mitsumasa Koyanagi:
Self-Assembly of Chip-Size Components with Cavity Structures: High-Precision Alignment and Direct Bonding without Thermal Compression for Hetero Integration. Micromachines 2(1): 49-68 (2011) - [c22]Takafumi Fukushima
, Yuki Ohara, Jichoel Bea, Mariappan Murugesan, Kang Wook Lee, Tetsu Tanaka
, Mitsumasa Koyanagi:
Temporary bonding strength control for self-assembly-based 3D integration. 3DIC 2011: 1-4 - [c21]Kazuyuki Hozawa, Futoshi Furuta, Yuko Hanaoka, Mayu Aoki, Kenichi Takeda, Katsuyuki Sakuma
, Kang Wook Lee, Takafumi Fukushima
, Mitsumasa Koyanagi:
Chip-level TSV integration for rapid prototyping of 3D system LSIs. 3DIC 2011: 1-4 - [c20]Yuka Ito, Shinsuke Terada, Shinya Arai, Koji Choki, Takafumi Fukushima
, Mitsumasa Koyanagi:
High-bandwidth data transmission of new transceiver module through optical interconnection. 3DIC 2011: 1-4 - [c19]Kouji Kiyoyama, Kang Wook Lee, Takafumi Fukushima
, H. Naganuma, H. Kobayashi, Tetsu Tanaka
, Mitsumasa Koyanagi:
A very low area ADC for 3-D stacked CMOS image processing system. 3DIC 2011: 1-4 - [c18]Kang Wook Lee, Jichoel Bea, Takafumi Fukushima
, Yuki Ohara, Tetsu Tanaka
, Mitsumasa Koyanagi:
High reliable and fine size of 5-μm diameter backside Cu through-silicon Via(TSV) for high reliability and high-end 3-D LSIs. 3DIC 2011: 1-4 - [c17]Makoto Motoyoshi, Junichi Takanohashi, Takafumi Fukushima
, Yasuo Arai, Mitsumasa Koyanagi:
Stacked SOI pixel detector using versatile fine pitch μ-bump technology. 3DIC 2011: 1-4 - [c16]Mariappan Murugesan, Hideto Hashiguchi, Harufumi Kobayashi, Takafumi Fukushima
, Tetsu Tanaka
, Mitsumasa Koyanagi:
W/Cu TSVs for 3D-LSI with minimum thermo-mechanical stress. 3DIC 2011: 1-4 - [c15]Mariappan Murugesan, Harufumi Kobayashi, Takafumi Fukushima
, Tetsu Tanaka
, Mitsumasa Koyanagi:
High density Cu-TSVs and reliability issues. 3DIC 2011: 1-4 - [c14]Akihiro Noriki, Kang Wook Lee, Jichoel Bea, Takafumi Fukushima
, Tetsu Tanaka, Mitsumasa Koyanagi:
Fabrication tolerance evaluation of high efficient unidirectional optical coupler for though silicon photonic via in optoelectronic 3D-LSI. 3DIC 2011: 1-4 - [c13]Yuki Ohara, Kang Wook Lee, Takafumi Fukushima
, Tetsu Tanaka
, Mitsumasa Koyanagi:
Novel detachable bonding process with wettability control of bonding surface for versatile chip-level 3D integration. 3DIC 2011: 1-4 - 2010
- [c12]Takafumi Fukushima
, Eiji Iwata, Jichoel Bea, Mariappan Murugesan, Kang Wook Lee, Tetsu Tanaka
, Mitsumasa Koyanagi:
Evaluation of alignment accuracy on chip-to-wafer self-assembly and mechanism on the direct chip bonding at room temperature. 3DIC 2010: 1-5 - [c11]Kouji Kiyoyama, Kang Wook Lee, Takafumi Fukushima
, H. Naganuma, Hiroaki Kobayashi, Tetsu Tanaka
, Mitsumasa Koyanagi:
A block-parallel signal processing system for CMOS image sensor with three-dimensional structure. 3DIC 2010: 1-4 - [c10]Mariappan Murugesan, Yuki Ohara, Jichoel Bea, Kang Wook Lee, Takafumi Fukushima
, Tetsu Tanaka
, Mitsumasa Koyanagi:
Impact of microbump induced stress in thinned 3D-LSIs after wafer bonding. 3DIC 2010: 1-5 - [c9]Akihiro Noriki, Kang Wook Lee, Jichoel Bea, Takafumi Fukushima
, Tetsu Tanaka
, Mitsumasa Koyanagi:
Through Silicon photonic via (TSPV) with Si core for low loss and high-speed data transmission in opto-electronic 3-D LSI. 3DIC 2010: 1-4 - [c8]Mitsumasa Koyanagi, Takafumi Fukushima
, Tetsu Tanaka
:
Three-dimensional integration technology using through-si via based on reconfigured wafer-to-wafer bonding. CICC 2010: 1-4
2000 – 2009
- 2009
- [j1]Mitsumasa Koyanagi, Takafumi Fukushima
, Tetsu Tanaka
:
High-Density Through Silicon Vias for 3-D LSIs. Proc. IEEE 97(1): 49-59 (2009) - [c7]Ji Chel Bea, Mariappan Murugesan, Yuki Ohara, Akihiro Noriki
, Hisashi Kino
, Kang Wook Lee, Takafumi Fukushima
, Tetsu Tanaka
, Mitsumasa Koyanagi:
Micro-Raman spectroscopy analysis and capacitance - time (C-t) measurement of thinned silicon substrates for 3D integration. 3DIC 2009: 1-5 - [c6]Takafumi Fukushima
, Eiji Iwata, Tetsu Tanaka
, Mitsumasa Koyanagi:
Development of a new self-assembled die bonder to three-dimensionally stack known good dies in batch. 3DIC 2009: 1-4 - [c5]Kouji Kiyoyama, Yuki Ohara, Kang Wook Lee, Y. Yang, Takafumi Fukushima
, Tetsu Tanaka
, Mitsumasa Koyanagi:
A parallel ADC for high-speed CMOS image processing system with 3D structure. 3DIC 2009: 1-4 - [c4]Kang Wook Lee, Shigeyuki Kanno, Yuki Ohara, Kouji Kiyoyama, Ji Chel Bea, Takafumi Fukushima
, Tetsu Tanaka
, Mitsumasa Koyanagi:
Heterogeneous integration technology for MEMS-LSI multi-chip module. 3DIC 2009: 1-6 - [c3]Yuki Ohara, Akihiro Noriki, Katsuyuki Sakuma
, Kang Wook Lee, Mariappan Murugesan, Jichoel Bea, Fumiaki Yamada, Takafumi Fukushima
, Tetsu Tanaka
, Mitsumasa Koyanagi:
10 µm fine pitch Cu/Sn micro-bumps for 3-D super-chip stack. 3DIC 2009: 1-6 - [c2]Mitsumasa Koyanagi, Takafumi Fukushima
, Tetsu Tanaka
:
Three-dimensional integration technology and integrated systems. ASP-DAC 2009: 409-415 - 2005
- [c1]Takeaki Sugimura, Yuta Konishi, Yoshihiro Nakatani, Takafumi Fukushima, Hiroyuki Kurino, Mitsumasa Koyanagi:
Dynamic Multi-Context Reconfiguration Scheme for Reconfigurable Parallel Image Processing System with Three Dimensional Structure. ARCS Workshops 2005: 27-32
Coauthor Index
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