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"Through-Silicon Via (TSV)-induced noise characterization and noise ..."

Nauman H. Khan, Syed M. Alam, Soha Hassoun (2009)

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DOI: 10.1109/3DIC.2009.5306579

access: closed

type: Conference or Workshop Paper

metadata version: 2017-05-21

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Nauman H. Khan, Syed M. Alam, Soha Hassoun:
Through-Silicon Via (TSV)-induced noise characterization and noise mitigation using coaxial TSVs. 3DIC 2009: 1-7

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