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Samson Melamed
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2010 – 2019
- 2017
- [j6]Samson Melamed
, Naoya Watanabe
Thermal impact of extreme die thinning in bump-bonded three-dimensional integrated circuits. Microelectron. Reliab. 79: 380-386 (2017) - 2016
- [j5]Samson Melamed
Impact of thinning stacked dies on the thermal resistance of bump-bonded three-dimensional integrated circuits. Microelectron. Reliab. 67: 2-8 (2016) - 2015
- [j4]Samson Melamed
Impact of die thinning on the thermal performance of a central TSV bus in a 3D stacked circuit. Microelectron. J. 46(12): 1106-1113 (2015) - [c9]Samson Melamed
Investigation of effects of metalization on heat spreading in bump-bonded 3D systems. 3DIC 2015: TS8.30.1-TS8.30.4 - 2012
- [j3]Shivam Priyadarshi, T. Robert Harris, Samson Melamed
Dynamic electrothermal simulation of three-dimensional integrated circuits using standard cell macromodels. IET Circuits Devices Syst. 6(1): 35-44 (2012) - [j2]Samson Melamed
Junction-Level Thermal Analysis of 3-D Integrated Circuits Using High Definition Power Blurring. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 31(5): 676-689 (2012) - 2011
- [c8]Shivam Priyadarshi, Jianchen Hu, Won Ha Choi, Samson Melamed
Pathfinder 3D: A flow for system-level design space exploration. 3DIC 2011: 1-8 - [c7]Paul D. Franzon
3D Specific Systems: Design and CAD. Asian Test Symposium 2011: 470-473 - [c6]Paul D. Franzon
3D specific systems design and CAD. ICSAMOS 2011: 326-329 - 2010
- [j1]Thorlindur Thorolfsson, Samson Melamed
Low-Power Hypercube Divided Memory FFT Engine Using 3D Integration. ACM Trans. Design Autom. Electr. Syst. 16(1): 5:1-5:25 (2010)
2000 – 2009
- 2009
- [c5]Samson Melamed
Junction-level thermal extraction and simulation of 3DICs. 3DIC 2009: 1-7 - [c4]Thorlindur Thorolfsson, Samson Melamed
Comparative analysis of two 3D integration implementations of a SAR processor. 3DIC 2009: 1-4 - 2008
- [c3]Christopher Mineo, Ravi Jenkal, Samson Melamed
Inter-die signaling in three dimensional integrated circuits. CICC 2008: 655-658 - [c2]Paul D. Franzon
Design and CAD for 3D integrated circuits. DAC 2008: 668-673 - 2006
- [c1]Hao Hua, Christopher Mineo, Kory Schoenfliess, Ambarish M. Sule, Samson Melamed
Exploring compromises among timing, power and temperature in three-dimensional integrated circuits. DAC 2006: 997-1002
Coauthor Index
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