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"A Cost-Aware Framework for Lifetime Reliability of TSV-Based 3D-IC Design."

Raviteja P. Reddy, Amit Acharyya, S. Saqib Khursheed (2020)

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DOI: 10.1109/TCSII.2020.2970724

access: closed

type: Journal Article

metadata version: 2020-12-17