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"Cohesive fracture mechanics based numerical analysis to BGA packaging and ..."

Yao Yao, Leon M. Keer (2013)

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DOI: 10.1016/J.MICROREL.2012.12.007

access: closed

type: Journal Article

metadata version: 2020-02-22

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Yao Yao, Leon M. Keer:
Cohesive fracture mechanics based numerical analysis to BGA packaging and lead free solders under drop impact. Microelectron. Reliab. 53(4): 629-637 (2013)

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