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"Low-loss shielded through-silicon vias filled with multi-walled carbon ..."

Jinrong Su et al. (2016)

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DOI: 10.1016/J.MEJO.2016.11.003

access: closed

type: Journal Article

metadata version: 2020-02-22

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  - journals/mj/SuMCHYZ16
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  - https://dblp.org/rec/journals/mj/SuMCHYZ16
Jinrong Su, Runbo Ma, Xinwei Chen, Liping Han, Rongcao Yang, Wenmei Zhang:
Low-loss shielded through-silicon vias filled with multi-walled carbon nanotube bundle. Microelectron. J. 58: 83-88 (2016)

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