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"System-Level Analysis of 3D ICs with Thermal TSVs."

Ayed Alqahtani et al. (2018)

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DOI: 10.1145/3264736

access: closed

type: Journal Article

metadata version: 2020-06-15

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  dblp key:
  - journals/jetc/AlqahtaniRLB18
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  - https://dblp.org/rec/journals/jetc/AlqahtaniRLB18
Ayed Alqahtani, Zongqing Ren, Jaeho Lee, Nader Bagherzadeh:
System-Level Analysis of 3D ICs with Thermal TSVs. ACM J. Emerg. Technol. Comput. Syst. 14(3): 37:1-37:16 (2018)

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