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"Through-silicon-via aware interconnect prediction and optimization for 3D ..."

Dae Hyun Kim, Saibal Mukhopadhyay, Sung Kyu Lim (2009)

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DOI: 10.1145/1572471.1572486

access: closed

type: Conference or Workshop Paper

metadata version: 2022-10-02

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Dae Hyun Kim, Saibal Mukhopadhyay, Sung Kyu Lim:
Through-silicon-via aware interconnect prediction and optimization for 3D stacked ICs. SLIP 2009: 85-92

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