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"Warpage Study by Employing an Advanced Simulation Methodology for ..."

Jun-Ho Choy et al. (2024)

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DOI: 10.1145/3626184.3635284

access: closed

type: Conference or Workshop Paper

metadata version: 2024-04-01

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  dblp key:
  - conf/ispd/ChoyMBSK24
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  - https://dblp.org/rec/conf/ispd/ChoyMBSK24
Jun-Ho Choy, Stéphane Moreau, Catherine Brunet-Manquat, Valeriy Sukharev, Armen Kteyan:
Warpage Study by Employing an Advanced Simulation Methodology for Assessing Chip Package Interaction Effects. ISPD 2024: 85-90

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