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"Sub-mW multi-Gbps chip-to-chip communication Links for Ultra-Low Power IoT ..."

Martino Dazzi et al. (2018)

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DOI: 10.1109/ISCAS.2018.8351893

access: closed

type: Conference or Workshop Paper

metadata version: 2020-03-27

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  dblp key:
  - conf/iscas/DazziPRBLBB18
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  - https://dblp.org/rec/conf/iscas/DazziPRBLBB18
Martino Dazzi, Pierpaolo Palestri, Davide Rossi, Andrea Bandiziol, Igor Loi, David E. Bellasi, Luca Benini:
Sub-mW multi-Gbps chip-to-chip communication Links for Ultra-Low Power IoT end-nodes. ISCAS 2018: 1-5

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