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"3D chip package interaction thermo-mechanical challenges: Proximity ..."

Wei Guo et al. (2012)

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DOI: 10.1109/ICICDT.2012.6232855

access: closed

type: Conference or Workshop Paper

metadata version: 2021-10-14

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  - conf/icicdt/GuoPIECWMGCRBJV12
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  - https://dblp.org/rec/conf/icicdt/GuoPIECWMGCRBJV12
Wei Guo, Geert Van der Plas, Andrej Ivankovic, Geert Eneman, Vladimir Cherman, Bart De Wachter, Abdelkarim Mercha, Mario Gonzalez, Yann Civale, Augusto Redolfi, Thibault Buisson, A. Jourdan, Bart Vandevelde, Kenneth J. Rebibis, Ingrid De Wolf, Antonio La Manna, Gerald Beyer, Eric Beyne, Bart Swinnen:
3D chip package interaction thermo-mechanical challenges: Proximity effects of Through Silicon vias and μ-bumps. ICICDT 2012: 1-4

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