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"A compact 3D silicon interposer package with integrated antenna for 60GHz ..."

Y. Lamy et al. (2013)

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DOI: 10.1109/3DIC.2013.6702345

access: closed

type: Conference or Workshop Paper

metadata version: 2020-11-05

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  - conf/3dic/LamyDBFSDV13
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  - https://dblp.org/rec/conf/3dic/LamyDBFSDV13
Y. Lamy, Laurent Dussopt, Ossama El Bouayadi, C. Ferrandon, Alexandre Siligaris, Cedric Dehos, Pierre Vincent:
A compact 3D silicon interposer package with integrated antenna for 60GHz wireless applications. 3DIC 2013: 1-6

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