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"Device physics aware 3D electromagnetic simulation of Through-Silicon-Vias ..."

Dipanjan Gope et al. (2013)

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DOI: 10.1109/3DIC.2013.6702340

access: closed

type: Conference or Workshop Paper

metadata version: 2023-06-13

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  - conf/3dic/GopeCACPC13
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  - https://dblp.org/rec/conf/3dic/GopeCACPC13
Dipanjan Gope, S. Chatterjee, D. de Araujo, Swagato Chakraborty, James Pingenot, Raul Camposano:
Device physics aware 3D electromagnetic simulation of Through-Silicon-Vias in system modeling. 3DIC 2013: 1-5

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