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"W/Cu TSVs for 3D-LSI with minimum thermo-mechanical stress."
Mariappan Murugesan et al. (2011)
- Mariappan Murugesan, Hideto Hashiguchi, Harufumi Kobayashi, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi:
W/Cu TSVs for 3D-LSI with minimum thermo-mechanical stress. 3DIC 2011: 1-4
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