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Young-Suk Kim
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2020 – today
- 2022
- [c11]Kyosuke Kobinata, Tatsuya Funaki, Yoshiaki Satake, Hitoshi Matsuno, Seiji Hidaka, Shunsuke Abe, Hiroyuki Ito, Chih-Cheng Hsiao, Sheng Yi Li, Young-Suk Kim, Takayuki Ohba:
Low-ESL (<1 pH @ 8.5 GHz) Multi-Terminal Si Capacitor Embedded in 3D Functional Interposer for Power Delivery Network. VLSI Technology and Circuits 2022: 385-386 - 2021
- [j3]Yae Rim Choi, Jaewon Shim
, Jae-Ho Park
Discovery of Orphan Olfactory Receptor 6M1 as a New Anticancer Target in MCF-7 Cells by a Combination of Surface Plasmon Resonance-Based and Cell-Based Systems. Sensors 21(10): 3468 (2021) - [c10]Zhwen Chen, Young-Suk Kim, Tadashi Fukuda, Koji Sakui, Takayuki Ohba, Tatsuji Kobayashi, Takashi Obara:
Reliability of Wafer-Level Ultra-Thinning down to 3 µm using 20 nm-Node DRAMs. IRPS 2021: 1-6
2010 – 2019
- 2019
- [c9]Chia-Hsuan Lee, Hsin-Chi Chang, Jui-Han Liu, Hiroyuki Ito, Young-Suk Kim, Kuan-Neng Chen, Takayuki Ohba:
Temperature Cycling Reliability of WOW Bumpless Through Silicon Vias. 3DIC 2019: 1-4 - 2015
- [j2]Takayuki Ohba, Young-Suk Kim, Yoriko Mizushima, Nobuhide Maeda, Koji Fujimoto, Shoichi Kodama:
Review of wafer-level three-dimensional integration (3DI) using bumpless interconnects for tera-scale generation. IEICE Electron. Express 12(7): 20152002 (2015) - [c8]Tomoji Nakamura, Yoriko Mizushima, Young-Suk Kim, Ryuichi Sugie
Characterization of stress distribution in ultra-thinned DRAM wafer. 3DIC 2015: TS3.2.1-TS3.2.5 - 2014
- [c7]Yoriko Mizushima, Young-Suk Kim, Tomoji Nakamura, Shoichi Kodama, Nobuhide Maeda, Koji Fujimoto, Takayuki Ohba:
Impact of Thermomechanical Stresses on Ultra-thin Si Stacked Structure. 3DIC 2014: 1-5 - 2013
- [j1]Sang Mi Lee, Gil-Ok Shin, Kyung Min Park
Determination of Odor Release in Hydrocolloid Model Systems Containing Original or Carboxylated Cellulose at Different pH Values Using Static Headspace Gas Chromatographic (SHS-GC) Analysis. Sensors 13(3): 2818-2829 (2013) - [c6]Tadao Nakamura, Yoriko Mizushima, Hideki Kitada, Young-Suk Kim, Nobuhide Maeda, Shoichi Kodama, Ryuichi Sugie
Influence of wafer thinning process on backside damage in 3D integration. 3DIC 2013: 1-6 - 2011
- [c5]Nobuhide Maeda, Young-Suk Kim, Y. Hikosaka, T. Eshita, Hideki Kitada, K. Fujimoto, Yoriko Mizushima, K. Suzuki, Tadao Nakamura, Akihito Kawai, Kazuhisa Arai, Takayuki Ohba:
Development of ultra-thinning technology for logic and memory heterogeneous stack applications. 3DIC 2011: 1-4 - [c4]Osamu Nakatsuka
Characterization of local strain around trough silicon via interconnects in wafer-on-wafer structures. 3DIC 2011: 1-4 - [c3]Sun-Young Lee, Yong-Ho Lee, Jin-Wook Beak, Young-Suk Kim, Hye-Rin Kim, In-Kwon Lee:
Video word balloon authoring system. SIGGRAPH Asia Posters 2011: 41:1-41:2
2000 – 2009
- 2009
- [c2]Young-Suk Kim, Joon-Woo Lee, Seongrae Park, ByoungCheol Choi:
Mobile advertisement system using data push scheduling based on user preference. WTS 2009: 1-5 - 2007
- [c1]Yu Tian, Lei Yan, Gun-Young Park, Seung-Han Yang, Young-Suk Kim, Sang-Ryong Lee, Choon-Young Lee:
Application of RRT-based local Path Planning Algorithm in Unknown Environment. CIRA 2007: 456-460
Coauthor Index
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