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Andrzej Dziedzic
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2020 – today
- 2024
- [j23]Andrzej Dziedzic
, Szymon Wójcik, Miroslaw Gierczak
Planar Thermoelectric Microgenerators in Application to Power RFID Tags. Sensors 24(5): 1646 (2024)
2010 – 2019
- 2018
- [j22]Arkadiusz Dabrowski, Andrzej Dziedzic
Stability of low ohmic thick-film resistors under pulsed operation. Microelectron. Reliab. 84: 95-104 (2018) - 2014
- [j21]Damian Nowak
Fabrication and advanced electrical and stability characterization of laser-shaped thick-film and LTCC microresistors for high temperature applications. Microelectron. Reliab. 54(11): 2641-2644 (2014) - 2012
- [j20]Wojciech Steplewski, Tomasz Serzysko
Preliminary assessment of the stability of thin- and polymer thick-film resistors embedded into printed wiring boards. Microelectron. Reliab. 52(8): 1719-1725 (2012) - 2011
- [j19]Andrzej Dziedzic
10th Electron Technology ELTE 2010 and 34th International Microelectronics and Packaging IMAPS/CPMT Poland Joint Conference - Guest Editorial. Microelectron. Reliab. 51(7): 1157-1158 (2011) - [j18]M. W. Dudek, Karol Nitsch, Andrzej Dziedzic
Wide frequency range ac electrical characterization of thick-film microvaristors. Microelectron. Reliab. 51(7): 1219-1224 (2011) - [j17]Damian Nowak
LTCC package for high temperature applications. Microelectron. Reliab. 51(7): 1241-1244 (2011)
2000 – 2009
- 2009
- [j16]Andrzej Dziedzic
IMAPS-CPMT Poland 2008 - Guest Editorial. Microelectron. Reliab. 49(6): 567-568 (2009) - [j15]Damian Nowak
Fabrication and electrical properties of laser-shaped thick-film and LTCC microresistors. Microelectron. Reliab. 49(6): 600-606 (2009) - [j14]Edward Mis, Andrzej Dziedzic
Microvaristors in thick-film and LTCC circuits. Microelectron. Reliab. 49(6): 607-613 (2009) - 2008
- [j13]Andrzej Dziedzic
IMAPS Poland 2007 - Guest Editorial. Microelectron. Reliab. 48(6): 859 (2008) - [j12]Krzysztof Mleczko, Zbigniew Zawislak, Adam Witold Stadler, Andrzej Kolek
Evaluation of conductive-to-resistive layers interaction in thick-film resistors. Microelectron. Reliab. 48(6): 881-885 (2008) - [j11]Piotr Markowski, Andrzej Dziedzic
Planar and three-dimensional thick-film thermoelectric microgenerators. Microelectron. Reliab. 48(6): 890-896 (2008) - 2007
- [j10]Andrzej Dziedzic
Polytronic 2005. Microelectron. Reliab. 47(2-3): 327 (2007) - [j9]Andrzej Dziedzic
Carbon/polyesterimide thick-film resistive composites - Experimental characterization and theoretical analysis of physicochemical, electrical and stability properties. Microelectron. Reliab. 47(2-3): 354-362 (2007) - 2006
- [j8]Andrzej Dziedzic
Advanced electrical and stability characterization of untrimmed and variously trimmed thick-film and LTCC resistors. Microelectron. Reliab. 46(2-4): 352-359 (2006) - 2005
- [j7]Andrzej Dziedzic
IMAPS Poland 2004 - Guest Editorial. Microelectron. Reliab. 45(12): 1901-1902 (2005) - [j6]Darko Belavic
Evaluation of compatibility of thick-film PTC thermistors and LTCC structures. Microelectron. Reliab. 45(12): 1924-1929 (2005) - [j5]Marek Wronski, Slawomir Kaminski, Edward Mis, Andrzej Dziedzic
New trim configurations for laser trimmed thick-film resistors - theoretical analysis, numerical simulation and experimental verification. Microelectron. Reliab. 45(12): 1941-1948 (2005) - 2003
- [j4]Andrzej Dziedzic
Special Section on IMAPS-Europe 2002. Microelectron. Reliab. 43(3): 343 (2003) - [j3]Andrzej Dziedzic
Fodel microresistors-processing and basic electrical properties. Microelectron. Reliab. 43(3): 377-383 (2003) - 2002
- [j2]Andrzej Dziedzic
Electrical and structural investigations in reliability characterisation of modern passives and passive integrated components. Microelectron. Reliab. 42(4-5): 709-719 (2002) - 2001
- [j1]Andrzej Dziedzic
Electrical and stability properties and ultrasonic microscope characterisation of low temperature co-fired ceramics resistors. Microelectron. Reliab. 41(5): 669-676 (2001)
Coauthor Index
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