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Gary K. Fedder
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- affiliation: Carnegie Mellon University, Pittsburgh, USA
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2020 – today
- 2024
- [j9]Xiaoliang Li
, Vincent P. J. Chung
A 46.6 μg/√Hz Single-Chip Accelerometer Exploiting a DTC-Assisted Chopper Amplifier. IEEE J. Solid State Circuits 59(2): 502-515 (2024) - [c24]Jace Rozsa, Sarah Costrell, Melisa Orta Martinez, Gary K. Fedder:
Fingertip Ultrasonic Array for Tactile Rendering. ICRA 2024: 9682-9688 - 2023
- [c23]Vishal Jain
High resolution focused non-invasive electrical stimulation of motor cortex in rodent model. NER 2023: 1-4 - 2020
- [c22]Gary K. Fedder, Vincent P. J. Chung, Metin G. Guney, Xiaoliang Li
High-g Capacitive Accelerometer Arrays with Low Bias Instability. PLANS 2020: 9-15 - [c21]Xiaoliang Li
A Reconfigurable High-Bandwidth CMOS-MEMS Capacitive Accelerometer Array with High-g Measurement Capability and Low Bias Instability. VLSI Circuits 2020: 1-2
2010 – 2019
- 2019
- [c20]Xiaoliang Li
A High Dynamic Range CMOS-MEMS Accelerometer Array with Drift Compensation and Fine-Grain Offset Compensation. CICC 2019: 1-4 - [c19]Mats Forssell
Compliant adhesive cuff electrode for selective stimulation in rat vagus nerve. IEEE SENSORS 2019: 1-4 - 2018
- [c18]Mats Forssell
Parylene neural probe with embedded CMOS multiplexing amplifier. EMBC 2018: 3374-3377 - 2017
- [c17]Luca Colombo, Mary Beth Galanko
Ultra-low-power and high sensitivity resonant micromechanical receiver. IEEE SENSORS 2017: 1-3 - [c16]Metin G. Guney, Vincent Pey J. Chung, Tamal Mukherjee
On-chip environmental sensors for bias drift compensation. IEEE SENSORS 2017: 1-3 - 2016
- [c15]You Liang Lionel Wong, Gary K. Fedder
Elastic ribbon-like piezoelectric energy harvester for wearable devices with stretchable surfaces. EMBC 2016: 4816-4819 - [c14]Xiao Chuan Ong, Amanda Willard, Mats Forssell
A silicon neural probe fabricated using DRIE on bonded thin silicon. EMBC 2016: 4885-4888 - 2014
- [j8]Mustafa Emre Karagozler, Ivan Poupyrev, Gary K. Fedder, Yuri Suzuki, Lining Yao, Ryuma Niiyama, Jifei Ou, Sean Follmer, Hiroshi Ishii, John Brosz, Miguel A. Nacenta, Richard Pusch, Sheelagh Carpendale, Christophe Hurter
Demo hour. Interactions 21(3): 6-9 (2014) - 2013
- [c13]Ahmad Khairi, Chenyang Wu, Yoed Rabin, Gary K. Fedder
Ultra-low power frequency and duty-cycle modulated implantable pressure-temperature sensor. BioCAS 2013: 226-229 - [c12]Wassim Ferose Habeeb Rakuman, Xiao Chuan Ong, H. Serhat Tetikol, Rakesh Khilwani
Ultra-compliant neural probes are subject to fluid forces during dissolution of polymer delivery vehicles. EMBC 2013: 1550-1553 - [c11]Mustafa Emre Karagozler, Ivan Poupyrev, Gary K. Fedder
Paper generators: harvesting energy from touching, rubbing and sliding. UIST 2013: 23-30 - 2012
- [c10]Fa Wang, Gokce Keskin, Andrew Phelps, Jonathan Rotner, Xin Li, Gary K. Fedder
Statistical design and optimization for adaptive post-silicon tuning of MEMS filters. DAC 2012: 176-181 - 2010
- [j7]David S. Ricketts, James A. Bain
Enhancing CMOS Using Nanoelectronic Devices: A Perspective on Hybrid Integrated Systems. Proc. IEEE 98(12): 2061-2075 (2010)
2000 – 2009
- 2009
- [c9]Tamal Mukherjee
RF-CMOS-MEMS based frequency-reconfigurable amplifiers. CICC 2009: 81-84 - 2008
- [j6]Gary K. Fedder
Technologies for Cofabricating MEMS and Electronics. Proc. IEEE 96(2): 306-322 (2008) - 2007
- [c8]Mustafa Emre Karagozler, Jason Campbell, Gary K. Fedder
Electrostatic latching for inter-module adhesion, power transfer, and communication in modular robots. IROS 2007: 2779-2786 - 2006
- [c7]Michael J. Bartkovsky, Amy Liao, Gary K. Fedder
The Effect of a Distributed Mass Loading on the Frequency Response of a MEMS Mesh Resonator. EMBC 2006: 1862-1865 - 2004
- [j5]Jiangfeng Wu, Gary K. Fedder
A low-noise low-offset capacitive sensing amplifier for a 50-μg√Hz monolithic CMOS MEMS accelerometer. IEEE J. Solid State Circuits 39(5): 722-730 (2004) - 2003
- [c6]Gary K. Fedder:
MEMS Fabrication. ITC 2003: 691-698 - 2002
- [j4]Hasnain Lakdawala, Xu Zhu, Hao Luo, Suresh Santhanam, L. Richard Carley, Gary K. Fedder
Micromachined high-Q inductors in a 0.18-μm copper interconnect low-k dielectric CMOS process. IEEE J. Solid State Circuits 37(3): 394-403 (2002) - [c5]Qi Jing, Tamal Mukherjee
Schematic-based lumped parameterized behavioral modeling for suspended MEMS. ICCAD 2002: 367-373 - 2001
- [c4]Hasnain Lakdawala, Xu Zhu, Hao Luo, Suresh Santhanam, L. Rick Carley, Gary K. Fedder:
Micromachined high-Q inductors in 0.18 μm Cu interconnect low-K CMOS. CICC 2001: 579-582 - 2000
- [j3]Tamal Mukherjee
Emerging simulation approaches for micromachined devices. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 19(12): 1572-1589 (2000)
1990 – 1999
- 1999
- [j2]Tamal Mukherjee
Hierarchical Design and Test of Integrated Microsystems. IEEE Des. Test Comput. 16(4): 18-27 (1999) - [j1]Tamal Mukherjee
Hierarchical Mixed-Domain Circuit Simulation, Synthesis and Extraction Methodology for MEMS. J. VLSI Signal Process. 21(3): 233-249 (1999) - [c3]Jacob K. White, Gary K. Fedder, Tamal Mukherjee:
Path toward future CAD environments for MEMS (tutorial abstract). ICCAD 1999: 606 - 1997
- [c2]Tamal Mukherjee
Structured Design of Microelectromechanical Systems. DAC 1997: 680-685 - 1996
- [c1]Richard M. Voyles
Design of a modular tactile sensor and actuator based on an electrorheological gel. ICRA 1996: 13-17
Coauthor Index
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