Sn-rich solder joints in three-dimensional integrated circuits and their reliability issues, such
as the electromigration (EM), thermomigration (TM), and thermomechanical fatigue (TMF), …

Near-infrared (NIR) small-molecule acceptors that absorb at wavelengths of up to 1000 nm
are attractive for applications in organic photodetectors (OPDs) and biometrics. In this study, …

The effects of Sn orientation and grain boundary misorientation on formation of Cu-Sn
intermetallic compounds (IMCs) during electromigration were investigated. Significant anisotropic …

Package-on-Package (PoP) is a popular technology for fabricating chipsets of accelerated
processing units. However, the coefficient of thermal expansion mismatch between Si chips …

Formic acid (FA) atmosphere is promising to achieve chemical reduction at the oxidized
surfaces of the solder and matrix material during soldering, replacing chemical flux being …

Graphene is widely used as a barrier at the solid–solid and gas–solid state interface. However,
the use of graphene as a barrier at the liquid–solid interface has been rarely reported, …

Thermomigration (TM) has become a critical reliability issue in advanced electronic packaging
because of Joule heating. A temperature gradient is required to conduct heat away, and …

Electroplated Cu has been extensively applied in advanced electronic packaging, and its
mechanical properties are critical for reliability. In this study, Cu foils fabricated through …

High-entropy alloy (HEA) FeCoNiCu (FCNC) can be potentially employed in electronic
packaging because it contains commonly used substrate metals. However, its microstructure, …

We examined the interfacial reactions between Sn–3.0Ag–0.5Cu (SAC305) alloy/FeCoNiMn
(FCNM) high-entropy alloy (HEA) and Sn–58Bi (SB58)/FCNM. FCNM exhibits a single …