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"Reliability of High-Voltage Molding Compounds: Particle Size, Curing Time, ..."

Andres Garcia et al. (2016)

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DOI: 10.1109/TIE.2016.2585467

access: closed

type: Journal Article

metadata version: 2021-10-14

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  - https://dblp.org/rec/journals/tie/GarciaWDTNDF16
Andres Garcia, Nathan Warner, Nandika Anne D'Souza, Enis Tuncer, Luu Nguyen, Marie Denison, Jeffrey T. Fong:
Reliability of High-Voltage Molding Compounds: Particle Size, Curing Time, Sample Thickness, and Voltage Impact on Polarization. IEEE Trans. Ind. Electron. 63(11): 7104-7111 (2016)

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