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"Strain engineering for bumping over IPs: Numerical investigations of ..."

Vincent Fiori et al. (2013)

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DOI: 10.1016/J.MICROREL.2012.08.015

access: closed

type: Journal Article

metadata version: 2021-10-14

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Vincent Fiori, Sébastien Gallois-Garreignot, Hervé Jaouen, Clément Tavernier:
Strain engineering for bumping over IPs: Numerical investigations of thermo-mechanical stress induced mobility variations for CMOS 32 nm and beyond. Microelectron. Reliab. 53(2): 229-235 (2013)

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