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"Post-bond Testing of the Silicon Interposer and Micro-bumps in 2.5D ICs."

Ran Wang, Krishnendu Chakrabarty, Bill Eklow (2013)

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DOI: 10.1109/ATS.2013.36

access: closed

type: Conference or Workshop Paper

metadata version: 2023-03-24

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Ran Wang, Krishnendu Chakrabarty, Bill Eklow:
Post-bond Testing of the Silicon Interposer and Micro-bumps in 2.5D ICs. Asian Test Symposium 2013: 147-152

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