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Joseph B. Bernstein
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2020 – today
- 2023
- [c9]Emmanuel Bender
, Joseph B. Bernstein, Duane S. Boning:
The Effects of Process Variations and BTI in Packaged FinFET Devices. IRPS 2023: 1-5 - [c8]Joseph B. Bernstein, Emmanuel Bender
The Correct Hot Carrier Degradation Model. IRPS 2023: 1-5 - 2021
- [j10]Emmanuel Bender
Microchip Health Monitoring System Using the FLL Circuit. Sensors 21(7): 2285 (2021)
2010 – 2019
- 2018
- [j9]Gady Golan
An improved reliability model for Si and GaN power FET. Microelectron. Reliab. 81: 77-89 (2018) - 2017
- [j8]Joseph B. Bernstein
Reliability prediction with MTOL. Microelectron. Reliab. 68: 91-97 (2017) - 2014
- [j7]Joseph B. Bernstein
Reliability matrix solution to multiple mechanism prediction. Microelectron. Reliab. 54(12): 2951-2955 (2014) - 2012
- [j6]I. Gershman, Joseph B. Bernstein
Structural health monitoring of solder joints in QFN package. Microelectron. Reliab. 52(12): 3011-3016 (2012) - 2011
- [j5]Bing Huang, Manuel Rodríguez, Ming Li, Joseph B. Bernstein
Hardware Error Likelihood Induced by the Operation of Software. IEEE Trans. Reliab. 60(3): 622-639 (2011)
2000 – 2009
- 2009
- [j4]Liyu Yang, Joseph B. Bernstein
Assessment of acceleration models used for BGA solder joint reliability studies. Microelectron. Reliab. 49(12): 1546-1554 (2009) - [j3]Liyu Yang, Joseph B. Bernstein
Failure rate estimation of known failure mechanisms of electronic packages. Microelectron. Reliab. 49(12): 1563-1572 (2009) - 2006
- [j2]Joseph B. Bernstein
Electronic circuit reliability modeling. Microelectron. Reliab. 46(12): 1957-1979 (2006) - 2005
- [j1]John S. Suehle, Baozhong Zhu, Yuan Chen, Joseph B. Bernstein
Detailed study and projection of hard breakdown evolution in ultra-thin gate oxides. Microelectron. Reliab. 45(3-4): 419-426 (2005) - [c7]Xiaojun Li, Bing Huang, J. Qin, X. Zhang, Michael Talmor, Z. Gur, Joseph B. Bernstein
Deep Submicron CMOS Integrated Circuit Reliability Simulation with SPICE. ISQED 2005: 382-389 - [c6]Xiaojun Li, Joerg D. Walter, Joseph B. Bernstein
Simulating and Improving Microelectronic Device Reliability by Scaling Voltage and Temperature. ISQED 2005: 496-502 - [c5]Bing Huang, Xiaojun Li, Ming Li, Joseph B. Bernstein
Study of the Impact of Hardware Fault on Software Reliability. ISSRE 2005: 63-72 - 2004
- [c4]Hu Huang, Joseph B. Bernstein
Combined Channel Segmentation and Buffer Insertion for Routability and Performance Improvement of Field. ICCD 2004: 490-495 - [c3]Ji Luo, Joseph B. Bernstein
A High Performance Radiation-Hard Field Programmable Analog Array . ISQED 2004: 522-527 - 2002
- [c2]Zhuo Gao, Ji Luo, Hu Huang, Wei Zhang, Joseph B. Bernstein
Reliable Laser Programmable Gate Array Technology. ISQED 2002: 252-256
1990 – 1999
- 1998
- [c1]Joseph B. Bernstein, Wei Zhang, Carl H. Nicholas:
Laser formed connections for programmable wiring. CICC 1998: 163-165 - 1990
- [b1]Joseph B. Bernstein:
Electrical characterization of polymeric insulation by electrically stimulated acoustic wave measurements. Massachusetts Institute of Technology, Cambridge, MA, USA, 1990
Coauthor Index
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