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Tomohiro Shimizu
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2020 – today
- 2023
- [i1]Ryo Hachiuma, Tomohiro Shimizu, Hideo Saito, Hiroki Kajita, Yoshifumi Takatsume:
Deep Selection: A Fully Supervised Camera Selection Network for Surgery Recordings. CoRR abs/2303.15947 (2023) - 2021
- [j1]Tomohiro Shimizu, Ryo Hachiuma, Hiroki Kajita
, Yoshifumi Takatsume
Hand Motion-Aware Surgical Tool Localization and Classification from an Egocentric Camera. J. Imaging 7(2): 15 (2021) - 2020
- [c12]Ryo Hachiuma
Deep Selection: A Fully Supervised Camera Selection Network for Surgery Recordings. MICCAI (3) 2020: 419-428 - [c11]Ayuka Yoshida, Tomohiro Shimizu, Tomoyuki Ohkubo, Kazuyuki Kobayashi, Kajiro Watanabe:
Development of a Person Search Components Based on an Omnidirectional Camera and a 3D-LiDAR. SICE 2020: 478-483 - [c10]Tomohiro Shimizu, Kei Oishi, Ryo Hachiuma, Hiroki Kajita, Yoshifumi Takatsume, Hideo Saito:
Surgery Recording without Occlusions by Multi-view Surgical Videos. VISIGRAPP (5: VISAPP) 2020: 837-844
2010 – 2019
- 2019
- [c9]Shunsuke Hanatani, Takuya Yorioka, Tomohiro Shimizu, Takeshi Ito, Shoso Shingubara:
Study of MacEtch using Additives for Preparation of TSV. 3DIC 2019: 1-4 - [c8]Taro Matsudaira, Shunsuke Shindo, Tomohiro Shimizu, Takeshi Ito, Shoso Shinguhara, Satoru Shimizu:
Cu Diffusion Barrier Properties of Various CoWB Electroless Plated Films on SiO2/Si Substrate for Via-last TSV Application. 3DIC 2019: 1-4 - [c7]Tomohiro Shimizu, Kei Oishi, Hideo Saito, Hiroki Kajita, Yoshifumi Takatsume:
Automatic Viewpoint Switching for Multi-view Surgical Videos. ISMAR Adjunct 2019: 89-90 - [c6]Tomohiro Shimizu, Ryo Hachiuma, Hideo Saito, Takashi Yoshikawa, Chonho Lee:
Prediction of Future Shot Direction using Pose and Position of Tennis Player. MMSports@MM 2019: 59-66 - 2018
- [c5]Tomohiro Shimizu, Wenyang Li, Peng Chen, Yinlai Jiang, Shunta Togo, Hiroshi Yokoi:
Toward Automatic Tuning of Tendon-driven Mechanisms: Vibration based Detection of Tendon Tension. ISR 2018: 389-394 - 2015
- [c4]Kohei Ohta, Atsushi Hirate, Yuto Miyachi, Tomohiro Shimizu, Shoso Shingubara:
All-wet TSV filling with highly adhesive displacement plated Cu seed layer. 3DIC 2015: TS8.4.1-TS8.4.3 - 2013
- [c3]S. Nishizawa, Ryohei Arima, Tomohiro Shimizu, Shoso Shingubara, Fumihiro Inoue
Highly conformal and adhesive electroless barrier and Cu seed formation using nanoparticle catalyst for realizing a high aspect ratio cu-filled TSV. 3DIC 2013: 1-4 - 2011
- [c2]Fumihiro Inoue
Low temperature through-Si via fabrication using electroless deposition. 3DIC 2011: 1-4 - 2010
- [c1]Fumihiro Inoue
All-wet fabrication technology for high aspect ratio TSV using electroless barrier and seed layers. 3DIC 2010: 1-5
Coauthor Index
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