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Jongmin Kim 0004
Person information
- affiliation: Chung-Ang University, School of Mechanical Engineering, Seoul, South Korea
Other persons with the same name
- Jongmin Kim (aka: Jong-Min Kim, Jong Min Kim, JongMin Kim) — disambiguation page
- Jongmin Kim 0001
— Pohang University of Science and Technology (POSTECH), Department of Integrative Biosciences and Biotechnology, South Korea (and 2 more)
- Jong Min Kim 0002 (aka: Jongmin Kim 0002) — KAIST, Department of Bio and Brain Engineering, Daejeon, South Korea (and 1 more)
- Jongmin Kim 0003 — Kosin University, Division of Computer Sciences, Soutn Korea
- Jongmin Kim 0005
- Jongmin Kim 0006 — Kakao Brain, Seongnam, South Korea (and 1 more)
- Jongmin Kim 0007
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2010 – 2019
- 2012
- [j5]Jiwon Kim, Byung-seung Yim, Jongmin Kim, Jooheon Kim:
The effects of functionalized graphene nanosheets on the thermal and mechanical properties of epoxy composites for anisotropic conductive adhesives (ACAs). Microelectron. Reliab. 52(3): 595-602 (2012) - [j4]Byung-seung Yim, Yumi Kwon, Seung Hoon Oh, Jooheon Kim, Yong-Eui Shin, Seong Hyuk Lee, Jongmin Kim:
Characteristics of solderable electrically conductive adhesives (ECAs) for electronic packaging. Microelectron. Reliab. 52(6): 1165-1173 (2012) - 2011
- [j3]Yumi Kwon, Byung-seung Yim, Jongmin Kim, Jooheon Kim:
Dispersion, hybrid interconnection and heat dissipation properties of functionalized carbon nanotubes in epoxy composites for electrically conductive adhesives (ECAs). Microelectron. Reliab. 51(4): 812-818 (2011) - [j2]Yumi Kwon, Byung-seung Yim, Jongmin Kim, Jooheon Kim:
Mechanical and wetting properties of epoxy resins: Amine-containing epoxy-terminated siloxane oligomer with or without reductant. Microelectron. Reliab. 51(4): 819-825 (2011) - 2010
- [j1]Hyomi Kim, Jongmin Kim, Jooheon Kim:
Effects of novel carboxylic acid-based reductants on the wetting characteristics of anisotropic conductive adhesive with low melting point alloy filler. Microelectron. Reliab. 50(2): 258-265 (2010)
Coauthor Index
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