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E. Liu

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This is just a disambiguation page, and is not intended to be the bibliography of an actual person. Any publication listed on this page has not been assigned to an actual author yet. If you know the true author of one of the publications listed below, you are welcome to contact us.

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2010 – 2019

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2017
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E. Liu, Thomas Zahner, Sebastian Besold, Bernhard Wunderle, Gordon Elger:
Location resolved transient thermal analysis to investigate crack growth in solder joints. Microelectron. Reliab. 79: 533-546 (2017)
2016
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Gordon Elger, Dominik Müller, Alexander Hanß, Maximilian Schmid, E. Liu, Udo Karbowski, Robert Derix:
Transient thermal analysis for accelerated reliability testing of LEDs. Microelectron. Reliab. 64: 605-609 (2016)
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E. Liu, Alexander Hanss, Maximilian Schmid, Gordon Elger:
The influence of the phosphor layer as heat source and up-stream thermal masses on the thermal characterization by transient thermal analysis of modern wafer level high power LEDs. Microelectron. Reliab. 67: 29-37 (2016)
2015
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Gordon Elger, Shri Vishnu Kandaswamy, E. Liu, Alexander Hanss, Maximilian Schmid, Robert Derix, Fosca Conti:
Analysis of solder joint reliability of high power LEDs by transient thermal testing and transient finite element simulations. Microelectron. J. 46(12): 1230-1238 (2015)
2011
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Ruili Wang, Yulong Zhang, Yi Huang, Fenglan Wei, Xuewei Bai, E. Liu:
Effect of burying the straw deeply and plastic mulching on soil water and yield of spring-sown maize. EMEIT 2011: 1818-1820
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Ruili Wang, Yulong Zhang, Yi Huang, Fenglan Wei, Xuewei Bai, E. Liu:
Mechanization of deep tillage and mulching to improve soil water content and spring maize yield. EMEIT 2011: 2098-2101

1990 – 1999

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1998
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E. Liu, C. Wong, Q. Shami, S. Mohapatra, R. Landy, P. Sheldon, G. Woodward:
Complete mixed-signal building blocks for single-chip GSM baseband processing. CICC 1998: 101-104

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