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Dim-Lee Kwong
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2020 – today
- 2022
- [i1]Jaime Gonzalo Flor Flores, Talha Yerebakan, Wenting Wang, Mingbin Yu, Dim-Lee Kwong, Andrey Matsko, Chee Wei Wong:
Parametrically driven inertial sensing in chip-scale optomechanical cavities at the thermodynamical limits with extended dynamic range. CoRR abs/2210.17014 (2022)
2010 – 2019
- 2017
- [c15]Heng Zhou, Z. J. Zhang, J. Zhang, Shu-Wei Huang, H. Liu, M. Yu, Dim-Lee Kwong, X. W. Yi, Kun Qiu, Chee Wei Wong:
Optical OFDM transmission using low-noise Kerr frequency comb generated in on-chip microresonator. OFC 2017: 1-3 - 2016
- [c14]Kazuhiro Goi, Norihiro Ishikura, Hiroki Ishihara, Shinichi Sakamoto, Kensuke Ogawa, Tsung-Yang Liow, Xiaoguang Tu, Guo-Qiang Lo, Dim-Lee Kwong:
Low-voltage silicon Mach-Zehnder modulator operating at high temperatures without thermo-electric cooling. OFC 2016: 1-3 - 2015
- [c13]Jinghui Yang, Shu-Wei Huang, Heng Zhou, Mingbin Yu, Dim-Lee Kwong, Chee Wei Wong:
A low-phase-noise 18 GHz Kerr frequency comb spanning 65 THz. OFC 2015: 1-3 - [c12]Heng Zhou, Shu-Wei Huang, K. K. Y. Wong, M. B. Yu, G.-Q. Lo, Dim-Lee Kwong, Kun Qiu, Chee Wei Wong:
Real-time spectral dynamics of femtosecond solitons under free-carrier nonlinearity in silicon photonic crystals. OFC 2015: 1-3 - 2014
- [j6]Kensuke Ogawa, Hiroki Ishihara, Kazuhiro Goi, Yasuhiro Mashiko, Soon Thor Lim, Min Jie Sun, Sean Seah, Ching Eng Png, Tsung-Yang Liow, Xiaoguang Tu, Guo-Qiang Lo, Dim-Lee Kwong:
Fundamental characteristics and high-speed applications of carrier-depletion silicon Mach-Zehnder modulators. IEICE Electron. Express 11(24): 20142010 (2014) - [c11]Kazuhiro Goi, Kenji Oda, Yasuhiro Mashiko, Kensuke Ogawa, Tsung-Yang Liow, Xiaoguang Tu, Guo-Qiang Lo, Dim-Lee Kwong:
128Gb/s DP-QPSK silicon modulator module integrated with driver amplifiers. ECOC 2014: 1-3 - [c10]Songsong Zhang, Tao Wang, Chengkuo Lee
, Liang Lou, Wei Mong Tsang, Dim-Lee Kwong:
Silicon Nanowires embedded pressure sensor with annularly grooved diaphragm for sensitivity improvement. ISSNIP 2014: 1-6 - [c9]Kazuhiro Goi, Hiroyuki Kusaka, Akira Oka, Kensuke Ogawa, Tsung-Yang Liow, Xiaoguang Tu, Guo-Qiang Lo, Dim-Lee Kwong:
128-Gb/s DP-QPSK using low-loss monolithic silicon IQ modulator integrated with partial-rib polarization rotator. OFC 2014: 1-3 - 2013
- [j5]Kazuhiro Goi, Kensuke Ogawa, Yong Tsong Tan, Vivek Dixit
Silicon Mach-Zehnder modulator using low-loss phase shifter with bottom PN junction formed by restricted-depth doping. IEICE Electron. Express 10(17): 20130552 (2013) - [j4]Kazuhiro Goi, Kenji Oda, Hiroyuki Kusaka, Akira Oka, Yoshihiro Terada, Kensuke Ogawa, Tsung-Yang Liow, Xiaoguang Tu, Guo-Qiang Lo, Dim-Lee Kwong:
Characterization of Silicon Mach-Zehnder Modulator in 20-Gbps NRZ-BPSK Transmission. IEICE Trans. Electron. 96-C(7): 974-980 (2013) - [c8]Zhuolin Xiang, Hao Wang, Songsong Zhang, Shih-Cheng Yen, Minkyu Je, Wei Mong Tsang, Yong Ping Xu, Nitish V. Thakor
Development of flexible neural probes using SU-8/parylene. NEMS 2013: 1076-1079 - [c7]Kazuhiro Goi, Hiroyuki Kusaka, Akira Oka, Yoshihiro Terada, Kensuke Ogawa, Tsung-Yang Liow, Xiaoguang Tu, Guo-Qiang Lo, Dim-Lee Kwong:
DQPSK/QPSK modulation at 40-60 Gb/s using low-loss nested silicon Mach-Zehnder modulator. OFC/NFOEC 2013: 1-3 - [c6]Kazuhiro Goi, Hiroyuki Kusaka, Akira Oka, Yoshihiro Terada, Kensuke Ogawa, Tsung-Yang Liow, Xiaoguang Tu, Guo-Qiang Lo, Dim-Lee Kwong:
20-Gb/s DPSK transmission with 550-ps/nm dispersion tolerance using silicon Mach-Zehnder modulator. OFC/NFOEC 2013: 1-3 - 2012
- [j3]HongYu Yu, Yuan Sun, Navab Singh, Guo-Qiang Lo, Dim-Lee Kwong:
Perspective of flash memory realized on vertical Si nanowires. Microelectron. Reliab. 52(4): 651-661 (2012) - [c5]Liang Lou, Songsong Zhang, Woo-Tae Park
Characterization of a multi-layered MEMS pressure sensor using piezoresistive silicon nanowire within large measurable strain range. NEMS 2012: 99-103 - 2011
- [c4]Xiaowu Zhang, Ranjan Rajoo, F. X. Che, C. S. Selvanayagam, W. K. Choi, Shan Gao, Guo-Qiang Lo, Dim-Lee Kwong:
A low stress bond pad design optimization of low temperature solder interconnections on TSVs for MEMS applications. 3DIC 2011: 1-5 - 2010
- [c3]Lan Peng, Hongyu Li, Dau Fatt Lim, Riko I. Made, Guo-Qiang Lo, Dim-Lee Kwong, Chuan Seng Tan
Fine-pitch bump-less Cu-Cu bonding for wafer-on-wafer stacking and its quality enhancement. 3DIC 2010: 1-5
2000 – 2009
- 2008
- [c2]Yuanjin Zheng, M. Annamalai Arasu, King-Wah Wong, Yen Ju The, Andrew Poh Hoe Suan, Duy Duong Tran, Wooi Gan Yeoh, Dim-Lee Kwong:
A 0.18μm CMOS 802.15.4a UWB Transceiver for Communication and Localization. ISSCC 2008: 118-119 - 2007
- [j2]Levent Yobas, Hongmiao Ji, Wing-Cheong Hui, Yu Chen, Tit Meng Lim, Chew-Kiat Heng
Nucleic Acid Extraction, Amplification, and Detection on Si-Based Microfluidic Platforms. IEEE J. Solid State Circuits 42(8): 1803-1813 (2007) - 2006
- [c1]Levent Yobas, Hongmiao Ji, Wing-Cheong Hui, Yu Chen, Tit Meng Lim, Chew-Kiat Heng
Nucleic Acid Extraction, Amplification, and Detection on Si-based Microfluidic Platforms. CICC 2006: 465-472 - 2002
- [j1]Carlton M. Osburn, Indong Kim, Sungkee Han, Indranil De, Kam F. Yee, Shyam Gannavaram, Sung-Joo Lee, Chung-Ho Lee, Zhijiong J. Luo, Wenjuan Zhu, John R. Hauser, Dim-Lee Kwong, Gerald Lucovsky, T. P. Ma, Mehmet C. Öztürk:
Vertically scaled MOSFET gate stacks and junctions: How far are we likely to go? IBM J. Res. Dev. 46(2-3): 299-316 (2002)
Coauthor Index
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