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Sandeep Kumar Samal
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2010 – 2019
- 2019
- [j8]Tianchen Wang
, Sandeep Kumar Samal
Entropy Production-Based Full-Chip Fatigue Analysis: From Theory to Mobile Applications. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 38(1): 84-95 (2019) - 2018
- [c8]Bon Woong Ku, Yu Liu, Yingyezhe Jin, Sandeep Kumar Samal, Peng Li, Sung Kyu Lim
Design and architectural co-optimization of monolithic 3D liquid state machine-based neuromorphic processor. DAC 2018: 165:1-165:6 - 2017
- [j7]Sandeep Kumar Samal
Improving Performance under Process and Voltage Variations in Near-Threshold Computing Using 3D ICs. ACM J. Emerg. Technol. Comput. Syst. 13(4): 59:1-59:18 (2017) - [j6]Sandeep Kumar Samal
Full Chip Impact Study of Power Delivery Network Designs in Gate-Level Monolithic 3-D ICs. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 36(6): 992-1003 (2017) - [j5]Shreepad Panth
Tier Degradation of Monolithic 3-D ICs: A Power Performance Study at Different Technology Nodes. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 36(8): 1265-1273 (2017) - [j4]Tiantao Lu
TSV-Based 3-D ICs: Design Methods and Tools. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 36(10): 1593-1619 (2017) - [c7]Sandeep Kumar Samal, Sourabh Khandelwal
Full chip power benefits with negative capacitance FETs. ISLPED 2017: 1-6 - 2016
- [j3]Sandeep Kumar Samal, Guoqing Chen, Sung Kyu Lim:
Machine Learning Based Variation Modeling and Optimization for 3D ICs. J. Inform. and Commun. Convergence Engineering 14(4) (2016) - [j2]Sandeep Kumar Samal, Shreepad Panth, Kambiz Samadi, Mehdi Saedi, Yang Du, Sung Kyu Lim
Adaptive Regression-Based Thermal Modeling and Optimization for Monolithic 3-D ICs. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 35(10): 1707-1720 (2016) - [c6]Sandeep Kumar Samal, Deepak Nayak, Motoi Ichihashi, Srinivasa Banna, Sung Kyu Lim
Tier partitioning strategy to mitigate BEOL degradation and cost issues in monolithic 3D ICs. ICCAD 2016: 129 - [c5]Sandeep Kumar Samal, Deepak Nayak, Motoi Ichihashi, Srinivasa Banna, Sung Kyu Lim
How to Cope with Slow Transistors in the Top-tier of Monolithic 3D ICs: Design Studies and CAD Solutions. ISLPED 2016: 320-325 - 2015
- [c4]Tianchen Wang, Sandeep Kumar Samal, Sung Kyu Lim
A Novel Entropy Production Based Full-Chip TSV Fatigue Analysis. ICCAD 2015: 744-751 - 2014
- [j1]Shreepad Panth, Sandeep Kumar Samal, Yun Seop Yu, Sung Kyu Lim:
Design Challenges and Solutions for Ultra-High-Density Monolithic 3D ICs. J. Inform. and Commun. Convergence Engineering 12(3): 186-192 (2014) - [c3]Sandeep Kumar Samal, Shreepad Panth, Kambiz Samadi, Mehdi Saedi, Yang Du, Sung Kyu Lim
Fast and Accurate Thermal Modeling and Optimization for Monolithic 3D ICs. DAC 2014: 206:1-206:6 - [c2]Sandeep Kumar Samal, Kambiz Samadi, Pratyush Kamal, Yang Du, Sung Kyu Lim
Full chip impact study of power delivery network designs in monolithic 3D ICs. ICCAD 2014: 565-572 - 2013
- [c1]Sandeep Kumar Samal, Yarui Peng
Design and analysis of ultra low power processors using sub/near-threshold 3D stacked ICs. ISLPED 2013: 21-26
Coauthor Index
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