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Peck Cheng Lim

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2000 – 2009

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2003
[j3]
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Jun Wei, F. L. Ng, M. L. Nai, H. Xie, Peck Cheng Lim, C. K. Wong:
Wafer Bonding Process Based On The Taguchi Analysis. Int. J. Comput. Eng. Sci. 4(2): 331-334 (2003)
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Yufeng Jin, Jun Wei, Peck Cheng Lim, Zhenfeng Wang:
Hermetic Packaging Of Mems With Thick Electrodes By Silicon-Glass Anodic Bonding. Int. J. Comput. Eng. Sci. 4(2): 335-338 (2003)
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Zhenfeng Wang, G. J. Qi, Jun Wei, Peck Cheng Lim, Yufeng Jin, C. K. Wong:
A Novel Wafer-Level Packaging Solution For Mems. Int. J. Comput. Eng. Sci. 4(2): 339-342 (2003)

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