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Willem D. van Driel
W. D. van Driel
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2020 – today
- 2024
- [j57]Paul Myland
, Alexander Herzog
LED Degradation Monitoring Using a Multi-Channel Spectral Sensor. IEEE Access 12: 42295-42315 (2024) - [j56]Victor Guerra
Towards a digital twin architecture for the lighting industry. Future Gener. Comput. Syst. 155: 80-95 (2024) - [j55]Roberto Rocchetta
Uncertainty analysis and interval prediction of LEDs lifetimes. Reliab. Eng. Syst. Saf. 242: 109715 (2024) - [c7]Wenyu Peng, Xinling Yue, Willem D. van Driel, Guoqi Zhang, Sijun Du:
A 70-V Fully Integrated Dual-SSHC Rectifier for Triboelectric Energy Harvesting with Full-Digital Duty-Cycle-Based MPPT Achieving 598% Power Extraction Enhancement. CICC 2024: 1-2 - [c6]Leonhard Faubel, Thomas Woudsma, Leila Methnani, Amir Ghorbani Ghezeljhemeidan, Fabian Bülow, Klaus Schmid, Willem D. van Driel, Benjamin Klöpper, Andreas Theodorou, Mohsen Nosratinia, Magnus Bång:
A MLOps Architecture for XAI in Industrial Applications. ETFA 2024: 1-4 - [c5]Wenyu Peng, Willem D. van Driel
An Efficient Rectifier Hybridizing Synchronized Electric Charge Extraction and Bias-Flipping for Triboelectric Energy Harvesting. ISCAS 2024: 1-5 - [c4]Varun Thukral, Chen He, Rebecca Chen, Letian Zhang, Romuald Roucou, Michiel van Soestbergen, Jeroen J. M. Zaal, Rene Rongen, Willem D. van Driel, G. Q. Zhang:
AI-Enabled Board Level Vibration Testing: Unveiling The Physics of Degradation. ITC 2024: 436-444 - 2023
- [j54]Alexander Herzog
Lifetime Prediction of Current-and Temperature-Induced Degradation in Silicone-Encapsulated 365 nm High-Power Light-Emitting Diodes. IEEE Access 11: 19928-19940 (2023) - [i1]Leonhard Faubel
Towards an MLOps Architecture for XAI in Industrial Applications. CoRR abs/2309.12756 (2023) - 2022
- [j53]Simon Benkner
Advancements in Spectral Power Distribution Modeling of Light-Emitting Diodes. IEEE Access 10: 83612-83619 (2022) - [c3]Leiming Du, Xiujuan Zhao, Piet Watté, René Poelma
Investigation of Potting Compounds on Thermal-Fatigue properties of Solder Interconnects. IECON 2022: 1-5 - 2021
- [c2]Klaus Pressel, Josef Moser, Sven Rzepka, Klas Brinkfeldt
The H2020-ECSEL Project "iRel40" (Intelligent Reliability 4.0). DSD 2021: 311-318
2010 – 2019
- 2018
- [j52]M. Yazdan Mehr, M. R. Toroghinejad
A review on discoloration and high accelerated testing of optical materials in LED based-products. Microelectron. Reliab. 81: 136-142 (2018) - [j51]Bo Sun, Xuejun Fan
A stochastic process based reliability prediction method for LED driver. Reliab. Eng. Syst. Saf. 178: 140-146 (2018) - 2017
- [j50]M. Yazdan Mehr, M. R. Toroghinejad
Reliability and diffusion-controlled through thickness oxidation of optical materials in LED-based products. Microelectron. Reliab. 78: 143-147 (2017) - [j49]Guangjun Lu, W. D. van Driel
Color shift acceleration on mid-power LED packages. Microelectron. Reliab. 78: 294-298 (2017) - [j48]Bo Sun, Xuejun Fan
A novel lifetime prediction for integrated LED lamps by electronic-thermal simulation. Reliab. Eng. Syst. Saf. 163: 14-21 (2017) - 2016
- [j47]Ee-Hua Wong
Creep fatigue models of solder joints: A critical review. Microelectron. Reliab. 59: 1-12 (2016) - [j46]W. D. van Driel
Lumen maintenance predictions for LED packages. Microelectron. Reliab. 62: 39-44 (2016) - [j45]B. Hamon, W. D. van Driel
LED degradation: From component to system. Microelectron. Reliab. 64: 599-604 (2016) - 2015
- [c1]Werner Rom, Peter Priller, Jani Koivusaari, Maarjana Komi, Ramiro Robles, Luis Dominguez, Javier Rivilla, Willem D. van Driel:
DEWI - Wirelessly into the Future. DSD 2015: 730-739 - 2014
- [j44]M. Yazdan Mehr, W. D. van Driel
Lifetime assessment of Bisphenol-A Polycarbonate (BPA-PC) plastic lens, used in LED-based products. Microelectron. Reliab. 54(1): 138-142 (2014) - [j43]S. Tarashioon, W. D. van Driel
Multi-physics reliability simulation for solid state lighting drivers. Microelectron. Reliab. 54(6-7): 1212-1222 (2014) - [j42]M. Yazdan Mehr, Willem D. van Driel
Accelerated life time testing and optical degradation of remote phosphor plates. Microelectron. Reliab. 54(8): 1544-1548 (2014) - [j41]M. Yazdan Mehr, Willem D. van Driel
Reliability and optical properties of LED lens plates under high temperature stress. Microelectron. Reliab. 54(11): 2440-2447 (2014) - 2012
- [j40]S. Tarashioon, Alessandro Baiano, Henk W. van Zeijl, C. Guo, S. W. Koh, W. D. van Driel
An approach to "Design for Reliability" in solid state lighting systems at high temperatures. Microelectron. Reliab. 52(5): 783-793 (2012) - [j39]Jianfei Dong
Diagnosing Lumen Depreciation in LED Lighting Systems: An Estimation Approach. IEEE Trans. Signal Process. 60(7): 3796-3808 (2012) - 2011
- [j38]Rene Kregting, Sander Gielen, Willem D. van Driel, Paul Alkemade, Hozan Miro, Jan-Dirk Kamminga:
Local stress analysis on semiconductor devices by combined experimental-numerical procedure. Microelectron. Reliab. 51(6): 1092-1096 (2011) - [j37]Dao-Guo Yang, F. F. Wan, Z. Y. Shou, Willem D. van Driel, H. Scholten, L. Goumans, Roberto Faria:
Effect of high temperature aging on reliability of automotive electronics. Microelectron. Reliab. 51(9-11): 1938-1942 (2011) - 2010
- [j36]J. de Vries, W. Balemans, W. D. van Driel:
Predictive modeling of board level shock-impact reliability of the HVQFN-family. Microelectron. Reliab. 50(2): 228-234 (2010) - [j35]Hendrik Pieter Hochstenbach, Willem D. van Driel, Dao-Guo Yang, Jeroen J. M. Zaal, E. Bagerman:
Designing for reliability using a new Wafer Level Package structure. Microelectron. Reliab. 50(4): 528-535 (2010) - [j34]Dao-Guo Yang, Martien Kengen, W. G. M. Peels, David Heyes, W. D. van Driel:
Reliability modeling on a MOSFET power package based on embedded die technology. Microelectron. Reliab. 50(7): 923-927 (2010) - [j33]Xiaosong Ma, Kaspar M. B. Jansen, G. Q. Zhang, Willem D. van Driel, Olaf van der Sluis
A fast moisture sensitivity level qualification method. Microelectron. Reliab. 50(9-11): 1654-1660 (2010) - [j32]Jeroen J. M. Zaal, Willem D. van Driel, G. Q. Zhang:
Challenges in the Assembly and Handling of Thin Film Capped MEMS Devices. Sensors 10(4): 3989-4001 (2010)
2000 – 2009
- 2009
- [j31]Ee-Hua Wong
Advances in the drop-impact reliability of solder joints for mobile applications. Microelectron. Reliab. 49(2): 139-149 (2009) - [j30]J. de Vries, M. Jansen, Willem D. van Driel:
Solder-joint reliability of HVQFN-packages subjected to thermal cycling. Microelectron. Reliab. 49(3): 331-339 (2009) - [j29]Jeroen J. M. Zaal, Hendrik Pieter Hochstenbach, Willem D. van Driel, G. Q. Zhang:
Solder interconnect reliability under drop impact loading conditions using High-speed Cold Bump Pull. Microelectron. Reliab. 49(8): 846-852 (2009) - [j28]Y. Liu, F. J. H. G. Kessels, Willem D. van Driel, J. A. S. van Driel, F. L. Sun, G. Q. Zhang:
Comparing drop impact test method using strain gauge measurements. Microelectron. Reliab. 49(9-11): 1299-1303 (2009) - 2008
- [j27]J. Thijsse, Olaf van der Sluis
Characterization of semiconductor interfaces using a modified mixed mode bending apparatus. Microelectron. Reliab. 48(3): 401-407 (2008) - [j26]Cadmus A. Yuan, Olaf van der Sluis
The need for multi-scale approaches in Cu/low-k reliability issues. Microelectron. Reliab. 48(6): 833-842 (2008) - [j25]Ee-Hua Wong
Correlation studies for component level ball impact shear test and board level drop test. Microelectron. Reliab. 48(7): 1069-1078 (2008) - [j24]Fenglian Sun, Hendrik Pieter Hochstenbach, Willem D. van Driel, G. Q. (Kouchi) Zhang:
Fracture morphology and mechanism of IMC in Low-Ag SAC Solder/UBM (Ni(P)-Au) for WLCSP. Microelectron. Reliab. 48(8-9): 1167-1170 (2008) - [j23]W. D. van Driel, Dao-Guo Yang, G. Q. Zhang:
On chip-package stress interaction. Microelectron. Reliab. 48(8-9): 1268-1272 (2008) - [j22]Jeroen J. M. Zaal, W. D. van Driel, S. Bendida, Q. Li, J. T. M. van Beek, G. Q. Zhang:
Packaging influences on the reliability of MEMS resonators. Microelectron. Reliab. 48(8-9): 1567-1571 (2008) - 2007
- [j21]W. D. van Driel, A. Mavinkurve, Marcel A. J. van Gils, G. Q. Zhang:
Advanced structural similarity rules for the BGA package family. Microelectron. Reliab. 47(2-3): 205-214 (2007) - [j20]Marcel A. J. van Gils, W. D. van Driel, G. Q. Zhang, H. J. L. Bressers, Richard B. R. van Silfhout, X. J. Fan, J. H. J. Janssen:
Virtual qualification of moisture induced failures of advanced packages. Microelectron. Reliab. 47(2-3): 273-279 (2007) - [j19]Artur Wymyslowski, W. D. van Driel, J. van de Peer, N. Tzannetakis, G. Q. Zhang:
Advanced numerical prototyping methods in modern engineering applications - Optimisation for micro-electronic package reliability. Microelectron. Reliab. 47(2-3): 280-289 (2007) - [j18]H. J. L. Bressers, W. D. van Driel, Kaspar M. B. Jansen, Leo J. Ernst, G. Q. Zhang:
Correlation between chemistry of polymer building blocks and microelectronics reliability. Microelectron. Reliab. 47(2-3): 290-294 (2007) - [j17]Dao-Guo Yang, Kaspar M. B. Jansen, Leo J. Ernst, G. Q. Zhang, W. D. van Driel, H. J. L. Bressers, J. H. J. Janssen:
Numerical modeling of warpage induced in QFN array molding process. Microelectron. Reliab. 47(2-3): 310-318 (2007) - [j16]J. W. C. de Vries, M. Y. Jansen, W. D. van Driel:
On the difference between thermal cycling and thermal shock testing for board level reliability of soldered interconnections. Microelectron. Reliab. 47(2-3): 444-449 (2007) - [j15]Cadmus A. Yuan, Olaf van der Sluis
Molecular simulation on the material/interfacial strength of the low-dielectric materials. Microelectron. Reliab. 47(9-11): 1483-1491 (2007) - [j14]Xiaosong Ma, Kaspar M. B. Jansen, Leo J. Ernst, W. D. van Driel, Olaf van der Sluis
Characterization of moisture properties of polymers for IC packaging. Microelectron. Reliab. 47(9-11): 1685-1689 (2007) - [j13]Willem D. van Driel, Dao-Guo Yang, Cadmus A. Yuan, M. van Kleef, G. Q. (Kouchi) Zhang:
Mechanical reliability challenges for MEMS packages: Capping. Microelectron. Reliab. 47(9-11): 1823-1826 (2007) - [j12]W. D. van Driel:
Facing the challenge of designing for Cu/low-k reliability. Microelectron. Reliab. 47(12): 1969-1974 (2007) - [j11]Olaf van der Sluis
Efficient damage sensitivity analysis of advanced Cu/low-k bond pad structures by means of the area release energy criterion. Microelectron. Reliab. 47(12): 1975-1982 (2007) - [j10]M. van Soestbergen, Leo J. Ernst, Kaspar M. B. Jansen, W. D. van Driel:
Measuring the through-plane elastic modulus of thin polymer films in situ. Microelectron. Reliab. 47(12): 1983-1988 (2007) - 2006
- [j9]R. L. J. M. Ubachs, Olaf van der Sluis
Multiscale modelling of multilayer substrates. Microelectron. Reliab. 46(9-11): 1472-1477 (2006) - [j8]Cadmus A. Yuan, Willem D. van Driel, Richard B. R. van Silfhout, Olaf van der Sluis
Delamination analysis of Cu/low-k technology subjected to chemical-mechanical polishing process conditions. Microelectron. Reliab. 46(9-11): 1679-1684 (2006) - [j7]W. D. van Driel, Olaf van der Sluis
Reliability modelling for packages in flexible end-products. Microelectron. Reliab. 46(9-11): 1880-1885 (2006) - 2005
- [j6]W. D. van Driel, Marcel A. J. van Gils, Richard B. R. van Silfhout, G. Q. Zhang:
Prediction of Delamination Related IC & Packaging Reliability Problems. Microelectron. Reliab. 45(9-11): 1633-1638 (2005) - 2004
- [j5]Marcel A. J. van Gils, P. J. J. H. A. Habets, G. Q. Zhang, Willem D. van Driel, Piet J. G. Schreurs:
Characterization and Modelling of Moisture Driven Interface Failures. Microelectron. Reliab. 44(9-11): 1317-1322 (2004) - [j4]Y. T. He, Marcel A. J. van Gils, Willem D. van Driel, G. Q. Zhang, Richard B. R. van Silfhout, Leo J. Ernst:
Prediction of crack growth in IC passivation layers. Microelectron. Reliab. 44(12): 2003-2009 (2004) - [j3]Viktor Gonda
Prediction of thermo-mechanical integrity of wafer backend processes. Microelectron. Reliab. 44(12): 2011-2017 (2004) - [j2]Willem D. van Driel, C. J. Liu, G. Q. Zhang, J. H. J. Janssen, Richard B. R. van Silfhout, Marcel A. J. van Gils, Leo J. Ernst:
Prediction of interfacial delamination in stacked IC structures using combined experimental and simulation methods. Microelectron. Reliab. 44(12): 2019-2027 (2004) - 2003
- [j1]W. D. van Driel, G. Q. Zhang, J. H. J. Janssen, Leo J. Ernst, Fei Su, Kerm Sin Chian, Sung Yi:
Prediction and verification of process induced warpage of electronic packages. Microelectron. Reliab. 43(5): 765-774 (2003)
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