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"TsanKit: artificial intelligence for solder ball head-in-pillow defect ..."

Ting-Chen Tsan, Teng-Fu Shih, Chiou-Shann Fuh (2021)

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DOI: 10.1007/S00138-021-01192-8

access: closed

type: Journal Article

metadata version: 2021-04-07

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  - https://dblp.org/rec/journals/mva/TsanSF21
Ting-Chen Tsan, Teng-Fu Shih, Chiou-Shann Fuh:
TsanKit: artificial intelligence for solder ball head-in-pillow defect inspection. Mach. Vis. Appl. 32(3): 66 (2021)

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