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"Model and simulation of Warpage in packaged IC strips after Mold Array ..."

Jose L. Ramirez et al. (2020)

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DOI: 10.1109/SBCCI50935.2020.9189900

access: closed

type: Conference or Workshop Paper

metadata version: 2023-09-30

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  - conf/sbcci/RamirezYNNC20
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  - https://dblp.org/rec/conf/sbcci/RamirezYNNC20
Jose L. Ramirez, Ricardo T. Yoshioka, Carolina C. P. Nunes, Igor Fernandes Namba, Claudemir Coral:
Model and simulation of Warpage in packaged IC strips after Mold Array Process. SBCCI 2020: 1-5

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