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"TSV Assignment of Thermal and Wirelength Optimization for 3D-IC Routing."

Yi Zhao, Cong Hao, Takeshi Yoshimura (2018)

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DOI: 10.1109/PATMOS.2018.8464161

access: closed

type: Conference or Workshop Paper

metadata version: 2022-10-02

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  dblp key:
  - conf/patmos/ZhaoHY18
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  - https://dblp.org/rec/conf/patmos/ZhaoHY18
Yi Zhao, Cong Hao, Takeshi Yoshimura:
TSV Assignment of Thermal and Wirelength Optimization for 3D-IC Routing. PATMOS 2018: 155-162

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