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"3D electro-optical integration based on high-performance Si photonics TSV ..."

Mingbin Yu et al. (2016)

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DOI: —

access: closed

type: Conference or Workshop Paper

metadata version: 2024-09-26

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  - electronic edition @ ieee.org
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  dblp key:
  - conf/ofc/YuYFTSCRL16
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  persistent URL:
  - https://dblp.org/rec/conf/ofc/YuYFTSCRL16
Mingbin Yu, Yan Yang, Qing Fang, Xiaoguang Tu, Junfeng Song, King-Jien Chui, Rusli, Guo-Qiang Lo:
3D electro-optical integration based on high-performance Si photonics TSV interposer. OFC 2016: 1-3

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