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Xuejun Fan
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2020 – today
- 2024
- [j23]Dawei Zhang, Siduo Song, Dehai Yu, Yueming Yuan, Hongmei Liu, Xuedong Liu, Xuejun Fan:
Hypergolic Ignition by Off-Center Binary Collision of Monoethanolamine-NaBH4 and Hydrogen Peroxide Droplets. Symmetry 16(6): 682 (2024) - 2020
- [c4]Xuejun Fan, Song Tian, Xiu Xu, Bao Li:
CSURF-TWO: CSIDH for the Ratio (2 : 1). Inscrypt 2020: 148-156 - [c3]Xuejun Fan, Xiu Xu, Bao Li:
Group Key Exchange Protocols from Supersingular Isogenies. Inscrypt 2020: 157-173
2010 – 2019
- 2019
- [j22]Bo Sun, Jiajie Fan, Xuejun Fan, Guoqi Zhang, Guohao Zhang:
A Reliability Prediction Methodology for LED Arrays. IEEE Access 7: 8127-8134 (2019) - [j21]Wei Chen, Jiajie Fan, Cheng Qian, Bin Pu, Xuejun Fan, Guoqi Zhang:
Reliability Assessment of Light-Emitting Diode Packages With Both Luminous Flux Response Surface Model and Spectral Power Distribution Method. IEEE Access 7: 68495-68502 (2019) - [c2]Weixuan Li, Wei Yu, Bao Li, Xuejun Fan:
Speeding up Scalar Multiplication on Koblitz Curves Using \mu _4 Coordinates. ACISP 2019: 620-629 - [c1]Xuejun Fan, Song Tian, Bao Li, Weixuan Li:
Constructing Hyperelliptic Covers for Elliptic Curves over Quadratic Extension Fields. ACISP 2019: 630-638 - [i1]Xuejun Fan, Song Tian, Bao Li, Xiu Xu:
CSIDH on Other Form of Elliptic Curves. IACR Cryptol. ePrint Arch. 2019: 1417 (2019) - 2018
- [j20]Hao Zhang, Yang Liu, Lingen Wang, Jiajie Fan, Xuejun Fan, Fenglian Sun, Guoqi Zhang:
A new hermetic sealing method for ceramic package using nanosilver sintering technology. Microelectron. Reliab. 81: 143-149 (2018) - [j19]Jiajie Fan, Jianwu Cao, Chaohua Yu, Cheng Qian, Xuejun Fan, Guoqi Zhang:
A design and qualification of LED flip Chip-on-Board module with tunable color temperatures. Microelectron. Reliab. 84: 140-148 (2018) - [j18]Ibrahim Khalilullah, Talukder Reza, Liangbiao Chen, Mark D. Placette, A. K. M. Monayem H. Mazumder, Jiang Zhou, Jiajie Fan, Cheng Qian, Guoqi Zhang, Xuejun Fan:
In-situ characterization of moisture absorption and hygroscopic swelling of silicone/phosphor composite film and epoxy mold compound in LED packaging. Microelectron. Reliab. 84: 208-214 (2018) - [j17]Bo Sun, Xuejun Fan, Willem D. van Driel, Chengqiang Cui, Guoqi Zhang:
A stochastic process based reliability prediction method for LED driver. Reliab. Eng. Syst. Saf. 178: 140-146 (2018) - [j16]Ning Yang, Dao-Guo Yang, Guoqi Zhang, Liangbiao Chen, Dongjing Liu, Miao Cai, Xuejun Fan:
The Effects of Graphene Stacking on the Performance of Methane Sensor: A First-Principles Study on the Adsorption, Band Gap and Doping of Graphene. Sensors 18(2): 422 (2018) - 2017
- [j15]Hongyu Tang, Huaiyu Ye, Xianping Chen, Cheng Qian, Xuejun Fan, Guoqi Zhang:
Numerical Thermal Analysis and Optimization of Multi-Chip LED Module Using Response Surface Methodology and Genetic Algorithm. IEEE Access 5: 16459-16468 (2017) - [j14]Cheng Qian, Jiajie Fan, Xuejun Fan, Guoqi Zhang:
Prediction of Lumen Depreciation and Color Shift for Phosphor-Converted White Light-Emitting Diodes Based on A Spectral Power Distribution Analysis Method. IEEE Access 5: 24054-24061 (2017) - [j13]Cheng Qian, Yun Li, Jiajie Fan, Xuejun Fan, Jiajia Fu, Lixia Zhao, Guoqi Zhang:
Studies of the light output properties for a GaN based blue LED using an electro-optical simulation method. Microelectron. Reliab. 74: 173-178 (2017) - [j12]Jiajie Fan, Chaohua Yu, Cheng Qian, Xuejun Fan, Guoqi Zhang:
Thermal/luminescence characterization and degradation mechanism analysis on phosphor-converted white LED chip scale packages. Microelectron. Reliab. 74: 179-185 (2017) - [j11]Liangbiao Chen, Jiang Zhou, Hsing-wei Chu, Guoqi Zhang, Xuejun Fan:
Modeling nonlinear moisture diffusion in inhomogeneous media. Microelectron. Reliab. 75: 162-170 (2017) - [j10]Hongyu Tang, Huaiyu Ye, Cell K. Y. Wong, Stanely Y. Y. Leung, Jiajie Fan, Xianping Chen, Xuejun Fan, Guoqi Zhang:
Overdriving reliability of chip scale packaged LEDs: Quantitatively analyzing the impact of component. Microelectron. Reliab. 78: 197-204 (2017) - [j9]Guangjun Lu, W. D. van Driel, Xuejun Fan, Jiajie Fan, Cheng Qian, G. Q. Zhang:
Color shift acceleration on mid-power LED packages. Microelectron. Reliab. 78: 294-298 (2017) - [j8]Bo Sun, Xuejun Fan, Huaiyu Ye, Jiajie Fan, Cheng Qian, Willem D. van Driel, Guoqi Zhang:
A novel lifetime prediction for integrated LED lamps by electronic-thermal simulation. Reliab. Eng. Syst. Saf. 163: 14-21 (2017) - 2016
- [j7]Jianlin Huang, Dusan S. Golubovic, Sau Koh, Dao-Guo Yang, Xiupeng Li, Xuejun Fan, G. Q. Zhang:
Lumen degradation modeling of white-light LEDs in step stress accelerated degradation test. Reliab. Eng. Syst. Saf. 154: 152-159 (2016) - [j6]Bo Sun, Xuejun Fan, Cheng Qian, Guoqi Zhang:
PoF-Simulation-Assisted Reliability Prediction for Electrolytic Capacitor in LED Drivers. IEEE Trans. Ind. Electron. 63(11): 6726-6735 (2016) - 2015
- [j5]Jianlin Huang, Dusan S. Golubovic, Sau Koh, Dao-Guo Yang, Xiupeng Li, Xuejun Fan, G. Q. Zhang:
Optical degradation mechanisms of mid-power white-light LEDs in LM-80-08 tests. Microelectron. Reliab. 55(12): 2654-2662 (2015) - 2012
- [j4]Mark D. Placette, Xuejun Fan, Jie-Hua Zhao, Darvin Edwards:
Dual stage modeling of moisture absorption and desorption in epoxy mold compounds. Microelectron. Reliab. 52(7): 1401-1408 (2012) - 2010
- [j3]Tong Yan Tee, Xuejun Fan, Yi-Shao Lai:
Advances in Wafer Level Packaging (WLP). Microelectron. Reliab. 50(4): 479-480 (2010) - [j2]Pridhvi Dandu, Xuejun Fan, Y. Liu, C. Diao:
Finite element modeling on electromigration of solder joints in wafer level packages. Microelectron. Reliab. 50(4): 547-555 (2010)
2000 – 2009
- 2004
- [j1]Xuejun Fan, Jiang Zhou, G. Q. Zhang:
Multi-physics modeling in virtual prototyping of electronic packages--combined thermal, thermo-mechanical and vapor pressure modeling. Microelectron. Reliab. 44(12): 1967-1976 (2004)
Coauthor Index
aka: Guoqi Zhang
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