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Patrick Justison
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2020 – today
- 2023
- [c9]Zhuo-Jie Wu, Ping-Chuan Wang, Seungman Choi, Patrick Justison, Martin Gall, Jae Kyu Cho, Takako Hirokawa, Yusheng Bian, Thomas Houghton, Vaishnavi Karra, Dan Moy, Karen Nummy, Dave Riggs, Norman Robson, Ian Melville, Ken Giewont:
Self-aligned Fiber Attach on Monolithic Silicon Photonic Chips: Moisture Effect and Hermetic Seal. OFC 2023: 1-3
2010 – 2019
- 2019
- [c8]C. S. Premachandran, Thuy Tran-Quinn, Lloyd Burrell, Patrick Justison:
A Comprehensive Wafer Level Reliability Study on 65nm Silicon Interposer. IRPS 2019: 1-8 - [c7]Tian Shen, Abu Naser Zainuddin, Purushothaman Srinivasan, Zakariae Chbili, Kai Zhao, Patrick Justison:
Novel Oxide Top-Off Process Enabling Reliable PC-CA TDDB on IO Devices with Self Aligned Contact. IRPS 2019: 1-5 - 2018
- [c6]Tian Shen, Kong Boon Yeap, Sean P. Ogden, Cathryn Christiansen, Patrick Justison:
New insight on TDDB area scaling methodology of non-Poisson systems. IRPS 2018: 1 - [c5]Seungman Choi, Cathryn Christiansen, Linjun Cao, James Zhang, Ronald Filippi, Tian Shen, Kong Boon Yeap, Sean P. Ogden, Haojun Zhang, Bianzhu Fu, Patrick Justison:
Effect of metal line width on electromigration of BEOL Cu interconnects. IRPS 2018: 4 - [c4]C. S. Premachandran, Seungman Choi, Salvatore Cimino, Thuy Tran-Quinn, Lloyd Burrell, Patrick Justison:
Reliability challenges for 2.5D/3D integration: An overview. IRPS 2018: 5 - 2015
- [c3]Wenyi Zhang, M. C. Silvestre, A. Selvam, E. Ramanathan, C. Ordonio, J. Schaller, Tian Shen, Kong Boon Yeap, C. Capasso, Patrick Justison, J. H. Lee:
An investigation of process dependence of porous IMD TDDB. IRPS 2015: 1 - [c2]Kong Boon Yeap, Tian Shen, Galor Wenyi Zhang, Sing Fui Yap, Brian Holt, Arfa Gondal, Seungman Choi, San Leong Liew, Walter Yao, Patrick Justison:
Impact of electrode surface modulation on time-dependent dielectric breakdown. IRPS 2015: 2 - [c1]Tian Shen, Wenyi Zhang, Kong Boon Yeap, Jing Tan, Walter Yao, Patrick Justison:
An investigation of dielectric thickness scaling on BEOL TDDB. IRPS 2015: 3
Coauthor Index
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