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Clément Tavernier
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2010 – 2019
- 2016
- [j4]Giacomo Garegnani
, Vincent Fiori, Gilles Gouget
Wafer level measurements and numerical analysis of self-heating phenomena in nano-scale SOI MOSFETs. Microelectron. Reliab. 63: 90-96 (2016) - 2015
- [j3]Sébastien Gallois-Garreignot, Naceur Benzima, Etienne Benmussa, Caroline Moutin, Pierre-Olivier Bouchard, Vincent Fiori, Clément Tavernier:
Qualification of bumping processes: Experimental and numerical investigations on mechanical stress and failure modes induced by shear test. Microelectron. Reliab. 55(6): 980-989 (2015) - 2014
- [j2]Vincent Fiori, Komi-Atchou Ewuame, Sébastien Gallois-Garreignot, Hervé Jaouen
Numerical analysis of thermo-mechanical and mobility effects for 28 nm node and beyond: Comparison and design consequences over bumping technologies. Microelectron. Reliab. 54(4): 764-772 (2014) - [c4]Frederic Monsieur, Yvan Denis, Denis Rideau, Vincent Quenette, Gilles Gouget, Clément Tavernier, Hervé Jaouen
The importance of the spacer region to explain short channels mobility collapse in 28nm Bulk and FDSOI technologies. ESSDERC 2014: 254-257 - [c3]Régis Leveugle, Paolo Maistri, Pierre Vanhauwaert, Feng Lu, Giorgio Di Natale, Marie-Lise Flottes, Bruno Rouzeyre, Athanasios Papadimitriou
Laser-induced fault effects in security-dedicated circuits. VLSI-SoC 2014: 1-6 - [c2]Vincent Beroulle, Philippe Candelier, Stephan De Castro, Giorgio Di Natale, Jean-Max Dutertre
Laser-Induced Fault Effects in Security-Dedicated Circuits. VLSI-SoC (Selected Papers) 2014: 220-240 - 2013
- [j1]Vincent Fiori, Sébastien Gallois-Garreignot, Hervé Jaouen
Strain engineering for bumping over IPs: Numerical investigations of thermo-mechanical stress induced mobility variations for CMOS 32 nm and beyond. Microelectron. Reliab. 53(2): 229-235 (2013) - [c1]Papa Momar Souare, François de Crecy, Vincent Fiori, M. Haykel Ben Jamaa, Alexis Farcy, Sébastien Gallois-Garreignot, Andras Borbely, Jean-Philippe Colonna, Perceval Coudrain
Thermal correlation between measurements and FEM simulations in 3D ICs. 3DIC 2013: 1-6
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