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"A hot embossing robot for bonding microfluidic chips: design, control and ..."

Dongxu Zhang et al. (2019)

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DOI: 10.1109/RCAR47638.2019.9044000

access: closed

type: Conference or Workshop Paper

metadata version: 2020-04-03

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  - conf/rcar/ZhangWZDWMG19
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  - https://dblp.org/rec/conf/rcar/ZhangWZDWMG19
Dongxu Zhang, Zhenyu Weng, Ya Zhang, Haozheng Dai, Jiageng Wu, Xiaoping Min, Shengxiang Ge:
A hot embossing robot for bonding microfluidic chips: design, control and test. RCAR 2019: 679-684

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